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| Datasheet | A2F060M3E-CS288 |
| File Size | 11,572.86 KB |
| Total Pages | 197 |
| Manufacturer | Microsemi |
| Website | https://www.microsemi.com/ |
| Total Parts | This datasheet covers 24 part numbers |
| Associated Parts | A2F060M3E-CS288, A2F060M3E-CSG288, A2F060M3E-1CSG288, A2F060M3E-1CSG288I, A2F060M3E-1CS288, A2F060M3E-1CS288I, A2F060M3E-CSG288I, A2F060M3E-CS288I, A2F060M3E-1FG256, A2F060M3E-FGG256, A2F060M3E-FG256, A2F060M3E-FG256I, A2F060M3E-1FGG256I, A2F060M3E-FGG256I, A2F060M3E-1FG256I, A2F060M3E-1FGG256, A2F060M3E-TQ144I, A2F060M3E-1TQ144, A2F060M3E-TQG144I, A2F060M3E-TQ144, A2F060M3E-TQG144, A2F060M3E-1TQG144, A2F060M3E-1TQG144I, A2F060M3E-1TQ144I |
| Description | IC SOC CORTEX-M3 80MHZ 288CSP, IC SOC CORTEX-M3 80MHZ 288CSP, IC SOC CORTEX-M3 100MHZ 288CSP, IC SOC CORTEX-M3 100MHZ 288CSP, IC SOC CORTEX-M3 100MHZ 288CSP |
A2F060M3E-CS288 - Microsemi
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Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -40°C ~ 100°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -40°C ~ 100°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -40°C ~ 100°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -40°C ~ 100°C (TJ) Package / Case 288-TFBGA, CSPBGA Supplier Device Package 288-CSP (11x11) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 100MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature 0°C ~ 85°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |
Manufacturer Microsemi Corporation Series SmartFusion® Architecture MCU, FPGA Core Processor ARM® Cortex®-M3 Flash Size 128KB RAM Size 16KB Peripherals DMA, POR, WDT Connectivity EBI/EMI, I²C, SPI, UART/USART Speed 80MHz Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Operating Temperature -40°C ~ 100°C (TJ) Package / Case 256-LBGA Supplier Device Package 256-FPBGA (17x17) |