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| Datasheet | AFS090-1QNG108I |
| File Size | 18,172.1 KB |
| Total Pages | 331 |
| Manufacturer | Microsemi |
| Website | https://www.microsemi.com/ |
| Total Parts | This datasheet covers 84 part numbers |
| Associated Parts | AFS090-1QNG108I, AFS090-QNG108, AFS090-1QNG108, AFS090-QNG108I, AFS090-2QNG108I, AFS090-2QNG108, AFS090-1QNG180I, M1AFS250-QNG180I, AFS090-QNG180I, AFS090-2QNG180, AFS090-2QNG180I, AFS090-1QNG180, AFS090-QNG180, AFS250-QNG180I, AFS250-1QNG180, M1AFS250-1QNG180I, AFS250-1QNG180I, M1AFS250-2QNG180, AFS250-2QNG180, M1AFS250-1QNG180, M1AFS250-2QNG180I, AFS250-2QNG180I, AFS250-QNG180, M1AFS250-QNG180, AFS090-2FGG256, AFS090-FGG256, AFS090-2FG256, AFS090-1FG256, AFS090-1FGG256, AFS090-FG256, AFS090-1FG256I, AFS090-2FGG256I, AFS090-2FG256I, AFS090-1FGG256I, AFS090-FG256I, AFS090-FGG256I, AFS250-PQ208, AFS250-PQG208, M1AFS250-PQ208, M1AFS250-PQG208 , etc. |
| Description | IC FPGA 37 I/O 108QFN, IC FPGA 37 I/O 108QFN, IC FPGA 37 I/O 108QFN, IC FPGA 37 I/O 108QFN, IC FPGA 37 I/O 108QFN |
AFS090-1QNG108I - Microsemi
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Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 37 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 108-WFQFN Supplier Device Package 108-QFN (8x8) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 36864 Number of I/O 65 Number of Gates 250000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |
Manufacturer Microsemi Corporation Series Fusion® Number of LABs/CLBs - Number of Logic Elements/Cells - Total RAM Bits 27648 Number of I/O 60 Number of Gates 90000 Voltage - Supply 1.425V ~ 1.575V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 180-WFQFN Dual Rows, Exposed Pad Supplier Device Package 180-QFN (10x10) |