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| Datasheet | BR25A512FJ-3MGE2 |
| File Size | 831.76 KB |
| Total Pages | 32 |
| Manufacturer | Rohm Semiconductor |
| Website | https://www.rohm.com/ |
| Total Parts | This datasheet covers 3 part numbers |
| Associated Parts | BR25A512FJ-3MGE2, BR25A512FVT-3MGE2, BR25A512F-3MGE2 |
| Description | 105°C OPERATION SPI BUS EEPR, 105°C OPERATION SPI BUS EEPR, 105°C OPERATION SPI BUS EEPR |
BR25A512FJ-3MGE2 - Rohm Semiconductor
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Manufacturer Rohm Semiconductor Series - Memory Type Non-Volatile Memory Format EEPROM Technology EEPROM Memory Size 512Kb (64K x 8) Memory Interface SPI Clock Frequency 10MHz Write Cycle Time - Word, Page 5ms Access Time - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 8-SOIC (0.154", 3.90mm Width) Supplier Device Package 8-SOP-J |
Manufacturer Rohm Semiconductor Series - Memory Type Non-Volatile Memory Format EEPROM Technology EEPROM Memory Size 512Kb (64K x 8) Memory Interface SPI Clock Frequency 10MHz Write Cycle Time - Word, Page 5ms Access Time - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 8-TSSOP (0.173", 4.40mm Width) Supplier Device Package 8-TSSOP-B |
Manufacturer Rohm Semiconductor Series - Memory Type Non-Volatile Memory Format EEPROM Technology EEPROM Memory Size 512Kb (64K x 8) Memory Interface SPI Clock Frequency 10MHz Write Cycle Time - Word, Page 5ms Access Time - Voltage - Supply 2.5V ~ 5.5V Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 8-SOIC (0.173", 4.40mm Width) Supplier Device Package 8-SOP |