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EPC2102ENG Datasheet

EPC2102ENG Cover
DatasheetEPC2102ENG
File Size1,674.61 KB
Total Pages7
ManufacturerEPC
Website
Total PartsThis datasheet covers 3 part numbers
Associated Parts EPC2102ENG, EPC2102ENGRT, EPC2102
Description GAN TRANS 2N-CH 60V BUMPED DIE, GANFET 2 N-CHANNEL 60V 23A DIE, GAN TRANS SYMMETRICAL HALF BRIDG

EPC2102ENG - EPC

EPC2102ENG Datasheet Page 1
EPC2102ENG Datasheet Page 2
EPC2102ENG Datasheet Page 3
EPC2102ENG Datasheet Page 4
EPC2102ENG Datasheet Page 5
EPC2102ENG Datasheet Page 6
EPC2102ENG Datasheet Page 7

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URL Link

Manufacturer

EPC

Series

eGaN®

FET Type

2 N-Channel (Half Bridge)

FET Feature

GaNFET (Gallium Nitride)

Drain to Source Voltage (Vdss)

60V

Current - Continuous Drain (Id) @ 25°C

23A

Rds On (Max) @ Id, Vgs

4.4mOhm @ 20A, 5V

Vgs(th) (Max) @ Id

2.5V @ 7mA

Gate Charge (Qg) (Max) @ Vgs

6.8nC @ 5V

Input Capacitance (Ciss) (Max) @ Vds

830pF @ 30V

Power - Max

-

Operating Temperature

-40°C ~ 150°C (TJ)

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

Die

Manufacturer

EPC

Series

eGaN®

FET Type

2 N-Channel (Half Bridge)

FET Feature

GaNFET (Gallium Nitride)

Drain to Source Voltage (Vdss)

60V

Current - Continuous Drain (Id) @ 25°C

23A (Tj)

Rds On (Max) @ Id, Vgs

4.4mOhm @ 20A, 5V

Vgs(th) (Max) @ Id

2.5V @ 7mA

Gate Charge (Qg) (Max) @ Vgs

6.8nC @ 5V

Input Capacitance (Ciss) (Max) @ Vds

830pF @ 30V

Power - Max

-

Operating Temperature

-40°C ~ 150°C (TJ)

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

Die

EPC2102

EPC

Manufacturer

EPC

Series

eGaN®

FET Type

2 N-Channel (Half Bridge)

FET Feature

GaNFET (Gallium Nitride)

Drain to Source Voltage (Vdss)

60V

Current - Continuous Drain (Id) @ 25°C

23A

Rds On (Max) @ Id, Vgs

4.4mOhm @ 20A, 5V

Vgs(th) (Max) @ Id

2.5V @ 7mA

Gate Charge (Qg) (Max) @ Vgs

6.8nC @ 5V

Input Capacitance (Ciss) (Max) @ Vds

830pF @ 30V

Power - Max

-

Operating Temperature

-40°C ~ 150°C (TJ)

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

Die