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| Datasheet | KKL03Z32CAF4R |
| File Size | 1,304.87 KB |
| Total Pages | 57 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 8 part numbers |
| Associated Parts | KKL03Z32CAF4R, MKL03Z8VFK4, MKL03Z16VFG4, MKL03Z16VFK4, MKL03Z8VFG4, MKL03Z32VFK4, MKL03Z32VFG4, MKL03Z32CAF4R |
| Description | IC MCU 32BIT 32KB FLASH 20WLCSP, IC MCU 32BIT 8KB FLASH 24QFN, IC MCU 32BIT 16KB FLASH 16QFN, IC MCU 32BIT 16KB FLASH 24QFN, IC MCU 32BIT 8KB FLASH 16QFN |
KKL03Z32CAF4R - NXP
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Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 18 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-UFBGA, WLCSP Supplier Device Package 20-WLCSP |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 22 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 24-UFQFN Exposed Pad Supplier Device Package 24-QFN (4x4) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 14 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-UFQFN Exposed Pad Supplier Device Package 16-QFN (3x3) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 22 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-QFN (4x4) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 14 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-UFQFN Exposed Pad Supplier Device Package 16-QFN (3x3) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 22 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-QFN (4x4) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 14 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-UFQFN Exposed Pad Supplier Device Package 16-QFN (3x3) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 18 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-UFBGA, WLCSP Supplier Device Package 20-WLCSP (2x1.61) |