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| Datasheet | LPC1820FBD144,551 |
| File Size | 6,899.85 KB |
| Total Pages | 154 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 12 part numbers |
| Associated Parts | LPC1820FBD144,551, LPC1810FBD144,551, LPC1850FET180,551, LPC1830FBD144K, LPC1810FET100,551, LPC1830FET100Y, LPC1830FBD144,551, LPC1830FET256,551, LPC1830FET180,551, LPC1830FET100,551, LPC1820FET100,551, LPC1850FET256,551 |
| Description | IC MCU 32BIT ROMLESS 144LQFP, IC MCU 32BIT ROMLESS 144LQFP, IC MCU 32BIT ROMLESS 180TFBGA, IC MCU 32BIT ROMLESS 144LQFP, IC MCU 32BIT ROMLESS 100TFBGA |
LPC1820FBD144,551 - NXP
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Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 83 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 168K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 144-LQFP Supplier Device Package 144-LQFP (20x20) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 83 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 136K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 144-LQFP Supplier Device Package 144-LQFP (20x20) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O 118 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 180-TFBGA Supplier Device Package 180-TFBGA (12x12) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 83 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 144-LQFP Supplier Device Package - |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 150MHz Connectivity CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Number of I/O 64 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 136K x 8 Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V Data Converters A/D 12x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 100-TFBGA Supplier Device Package 100-TFBGA (9x9) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Number of I/O 49 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-TFBGA Supplier Device Package 100-TFBGA (9x9) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 83 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 144-LQFP Supplier Device Package 144-LQFP (20x20) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 164 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-LBGA (17x17) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O 118 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 180-TFBGA Supplier Device Package 180-TFBGA (12x12) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, POR, WDT Number of I/O 49 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-TFBGA Supplier Device Package 100-TFBGA (9x9) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 150MHz Connectivity CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Number of I/O 64 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 168K x 8 Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V Data Converters A/D 12x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-TFBGA Supplier Device Package 100-TFBGA (9x9) |
Manufacturer NXP USA Inc. Series LPC18xx Core Processor ARM® Cortex®-M3 Core Size 32-Bit Speed 180MHz Connectivity CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O 164 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 200K x 8 Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V Data Converters A/D 8x10b; D/A 1x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-LBGA (17x17) |