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| Datasheet | LPC2923FBD100,551 |
| File Size | 551.12 KB |
| Total Pages | 84 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 3 part numbers |
| Associated Parts | LPC2923FBD100,551, LPC2921FBD100,551, LPC2925FBD100,551 |
| Description | IC MCU 32BIT 256KB FLASH 100LQFP, IC MCU 32BIT 128KB FLASH 100LQFP, IC MCU 32BIT 512KB FLASH 100LQFP |
LPC2923FBD100,551 - NXP
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Manufacturer NXP USA Inc. Series LPC2900 Core Processor ARM9® Core Size 16/32-Bit Speed 125MHz Connectivity CANbus, I²C, LINbus, SPI, UART/USART, USB Peripherals DMA, POR, PWM, WDT Number of I/O 60 Program Memory Size 256KB (256K x 8) Program Memory Type FLASH EEPROM Size 16K x 8 RAM Size 24K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |
Manufacturer NXP USA Inc. Series LPC2900 Core Processor ARM9® Core Size 16/32-Bit Speed 125MHz Connectivity CANbus, I²C, LINbus, SPI, UART/USART, USB Peripherals DMA, POR, PWM, WDT Number of I/O 60 Program Memory Size 128KB (128K x 8) Program Memory Type FLASH EEPROM Size 16K x 8 RAM Size 24K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |
Manufacturer NXP USA Inc. Series LPC2900 Core Processor ARM9® Core Size 16/32-Bit Speed 125MHz Connectivity CANbus, I²C, LINbus, SPI, UART/USART, USB Peripherals DMA, POR, PWM, WDT Number of I/O 60 Program Memory Size 512KB (512K x 8) Program Memory Type FLASH EEPROM Size 16K x 8 RAM Size 40K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 16x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 100-LQFP Supplier Device Package 100-LQFP (14x14) |