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LPC834M101FHI33Y Datasheet

LPC834M101FHI33Y Cover
DatasheetLPC834M101FHI33Y
File Size1,788.2 KB
Total Pages78
ManufacturerNXP
Website
Total PartsThis datasheet covers 2 part numbers
Associated Parts LPC834M101FHI33Y, LPC832M101FDH20FP
Description IC MCU 32BIT 32KB FLASH 32HVQFN, IC MCU 32BIT 16KB FLASH 20TSSOP

LPC834M101FHI33Y - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

LPC83x

Core Processor

ARM® Cortex®-M0+

Core Size

32-Bit

Speed

30MHz

Connectivity

I²C, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O

29

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 12x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-VFQFN Exposed Pad

Supplier Device Package

32-HVQFN (5x5)

Manufacturer

NXP USA Inc.

Series

LPC83x

Core Processor

ARM® Cortex®-M0+

Core Size

32-Bit

Speed

30MHz

Connectivity

I²C, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, DMA, POR, PWM, WDT

Number of I/O

16

Program Memory Size

16KB (16K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 5x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

20-TSSOP