Datasheet | MC68HC11D0CFNE3R |
File Size | 1,551.08 KB |
Total Pages | 138 |
Manufacturer | NXP |
Website | |
Total Parts | This datasheet covers 16 part numbers |
Associated Parts | MC68HC11D0CFNE3R, MC68HC11D0CFNE2R, MC68HC11D0CFNE2, MC68HC11D0CFBE3R, MC68HC11D0CFBE2, MC68711D3CFBE2, MC68HC11D0CFBE3, MC68L11D0CFBE2R, MC68HC711D3VFNE2, MC68L11D0FNE2, MC68L11D0CFBE2, MC68HC711D3CFNE3, MC68HC711D3CFNE2, MC68HC11D0CFNE3, MC68HC711D3CFN2, MC711D3CFNE2R |
Description | IC MCU 8BIT ROMLESS 44PLCC, IC MCU 8BIT ROMLESS 44PLCC, IC MCU 8BIT ROMLESS 44PLCC, IC MCU 8BIT ROMLESS 44QFP, IC MCU 8BIT ROMLESS 44QFP |
MC68HC11D0CFNE3R - NXP
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NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-LCC (J-Lead) Supplier Device Package 44-PLCC (16.59x16.59) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-LCC (J-Lead) Supplier Device Package 44-PLCC (16.59x16.59) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-LCC (J-Lead) Supplier Device Package 44-PLCC (16.59x16.59) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size 4KB (4K x 8) Program Memory Type OTP EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size 4KB (4K x 8) Program Memory Type OTP EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 44-LCC (J-Lead) Supplier Device Package 44-PLCC (16.59x16.59) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 44-LCC (J-Lead) Supplier Device Package 44-PLCC (16.59x16.59) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-QFP Supplier Device Package 44-QFP (10x10) |
NXP Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 26 Program Memory Size 4KB (4K x 8) Program Memory Type OTP EEPROM Size - RAM Size 192 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 44-LCC (J-Lead) Supplier Device Package 44-PLCC (16.59x16.59) |