Datasheet | MC908QB4MDTE |
File Size | 3,784.51 KB |
Total Pages | 232 |
Manufacturer | NXP |
Website | |
Total Parts | This datasheet covers 22 part numbers |
Associated Parts | MC908QB4MDTE, MCL908QB8PE, MCL908QB8DWE, MCL908QB8DTE, MC908QY8CPE, MC908QY8CDWE, MC908QY8CDTE, MC908QB8MPE, MC908QB8MDWE, MC908QB8MDTE, MC908QB8CPE, MC908QB8CDTE, MC908QB4CPE, MC908QB4CDWE, MC908QB4CDTE, MC908QB8VDWE, MC908QB4MDWE, MC908QY8VDWE, MC908QY8CDWER, MC908QB4CDWER, MC908QB8CDWE, MC908QB8CDWER |
Description | IC MCU 8BIT 4KB FLASH 16TSSOP, IC MCU 8BIT 8KB FLASH 16DIP, IC MCU 8BIT 8KB FLASH 16SOIC, IC MCU 8BIT 8KB FLASH 16TSSOP, IC MCU 8BIT 8KB FLASH 16DIP |
MC908QB4MDTE - NXP
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MC908QB4MDTE | NXP | IC MCU 8BIT 4KB FLASH 16TSSOP | 135 More on Order |
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MC908QY8CDTE | NXP | IC MCU 8BIT 8KB FLASH 16TSSOP | 486 More on Order |
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MC908QB8MPE | NXP | IC MCU 8BIT 8KB FLASH 16DIP | 492 More on Order |
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MC908QB8MDWE | NXP | IC MCU 8BIT 8KB FLASH 16SOIC | 125 More on Order |
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MC908QB8MDTE | NXP | IC MCU 8BIT 8KB FLASH 16TSSOP | 332 More on Order |
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MC908QB8CPE | NXP | IC MCU 8BIT 8KB FLASH 16DIP | 109 More on Order |
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MC908QB8CDTE | NXP | IC MCU 8BIT 8KB FLASH 16TSSOP | 127 More on Order |
URL Link
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 128 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 16-SOIC (0.295", 7.50mm Width) Supplier Device Package 16-SOIC |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature 0°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 4x10b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 4x10b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 16-SOIC (0.295", 7.50mm Width) Supplier Device Package 16-SOIC |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity - Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 4x10b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 16-SOIC (0.295", 7.50mm Width) Supplier Device Package 16-SOIC |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 16-DIP (0.300", 7.62mm) Supplier Device Package 16-DIP |
NXP Manufacturer NXP USA Inc. Series HC08 Core Processor HC08 Core Size 8-Bit Speed 8MHz Connectivity SCI, SPI Peripherals LVD, POR, PWM Number of I/O 13 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V Data Converters A/D 10x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package 16-TSSOP |