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MCF5373LCVM240J Datasheet

MCF5373LCVM240J Cover
DatasheetMCF5373LCVM240J
File Size1,789.65 KB
Total Pages46
ManufacturerNXP
Website
Total PartsThis datasheet covers 5 part numbers
Associated Parts MCF5373LCVM240J, MCF5372LCVM240J, MCF53721CVM240, MCF5373LCVM240, MCF5372LCVM240
Description IC MCU 32BIT ROMLESS 196MAPBGA, IC MCU 32BIT ROMLESS 196MAPBGA, IC MCU 32BIT ROMLESS 196MAPBGA, IC MCU 32BIT ROMLESS 196MAPBGA, IC MCU 32BIT ROMLESS 196MAPBGA

MCF5373LCVM240J - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

MCF537x

Core Processor

Coldfire V3

Core Size

32-Bit

Speed

240MHz

Connectivity

EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG

Peripherals

DMA, POR, PWM, WDT

Number of I/O

62

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

1.4V ~ 3.6V

Data Converters

-

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

196-LBGA

Supplier Device Package

196-MAPBGA (15x15)

Manufacturer

NXP USA Inc.

Series

MCF537x

Core Processor

Coldfire V3

Core Size

32-Bit

Speed

240MHz

Connectivity

EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG

Peripherals

DMA, POR, PWM, WDT

Number of I/O

62

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

1.4V ~ 3.6V

Data Converters

-

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

196-LBGA

Supplier Device Package

196-MAPBGA (15x15)

Manufacturer

NXP USA Inc.

Series

MCF537x

Core Processor

Coldfire V3

Core Size

32-Bit

Speed

240MHz

Connectivity

EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG

Peripherals

DMA, POR, PWM, WDT

Number of I/O

62

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

1.4V ~ 3.6V

Data Converters

-

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

196-LBGA

Supplier Device Package

196-MAPBGA (15x15)

Manufacturer

NXP USA Inc.

Series

MCF537x

Core Processor

Coldfire V3

Core Size

32-Bit

Speed

240MHz

Connectivity

EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG

Peripherals

DMA, POR, PWM, WDT

Number of I/O

62

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

1.4V ~ 3.6V

Data Converters

-

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

196-LBGA

Supplier Device Package

196-MAPBGA (15x15)

Manufacturer

NXP USA Inc.

Series

MCF537x

Core Processor

Coldfire V3

Core Size

32-Bit

Speed

240MHz

Connectivity

EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG

Peripherals

DMA, POR, PWM, WDT

Number of I/O

62

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

1.4V ~ 3.6V

Data Converters

-

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

196-LBGA

Supplier Device Package

196-MAPBGA (15x15)