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MCHRC705J1ACDWE Datasheet

MCHRC705J1ACDWE Cover
DatasheetMCHRC705J1ACDWE
File Size2,696.45 KB
Total Pages162
ManufacturerNXP
Website
Total PartsThis datasheet covers 7 part numbers
Associated Parts MCHRC705J1ACDWE, MC68HC705J1ACPE, MC705J1ACDWE, MC68HSR705J1ACPE, MC68HSC705J1ACPE, MC68HC705J1ACP, MC68HC705J1ACDW
Description IC MCU 8BIT 1.2KB OTP 20SOIC, IC MCU 8BIT 1.2KB OTP 20DIP, IC MCU 8BIT 1.2KB OTP 20SOIC, IC MCU 8BIT 1.2KB OTP 20DIP, IC MCU 8BIT 1.2KB OTP 20DIP

MCHRC705J1ACDWE - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

HC05

Core Processor

HC05

Core Size

8-Bit

Speed

4MHz

Connectivity

-

Peripherals

POR, WDT

Number of I/O

14

Program Memory Size

1.2KB (1.2K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

64 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-SOIC (0.295", 7.50mm Width)

Supplier Device Package

20-SOIC

Manufacturer

NXP USA Inc.

Series

HC05

Core Processor

HC05

Core Size

8-Bit

Speed

4MHz

Connectivity

-

Peripherals

POR, WDT

Number of I/O

14

Program Memory Size

1.2KB (1.2K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

64 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

20-DIP (0.300", 7.62mm)

Supplier Device Package

20-DIP

Manufacturer

NXP USA Inc.

Series

HC05

Core Processor

HC05

Core Size

8-Bit

Speed

4MHz

Connectivity

-

Peripherals

POR, WDT

Number of I/O

14

Program Memory Size

1.2KB (1.2K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

64 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-SOIC (0.295", 7.50mm Width)

Supplier Device Package

20-SOIC

Manufacturer

NXP USA Inc.

Series

HC05

Core Processor

HC05

Core Size

8-Bit

Speed

4MHz

Connectivity

-

Peripherals

POR, WDT

Number of I/O

14

Program Memory Size

1.2KB (1.2K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

64 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

20-DIP (0.300", 7.62mm)

Supplier Device Package

20-DIP

Manufacturer

NXP USA Inc.

Series

HC05

Core Processor

HC05

Core Size

8-Bit

Speed

4MHz

Connectivity

-

Peripherals

POR, WDT

Number of I/O

14

Program Memory Size

1.2KB (1.2K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

64 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

20-DIP (0.300", 7.62mm)

Supplier Device Package

20-DIP

Manufacturer

NXP USA Inc.

Series

HC05

Core Processor

HC05

Core Size

8-Bit

Speed

4MHz

Connectivity

-

Peripherals

POR, WDT

Number of I/O

14

Program Memory Size

1.2KB (1.2K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

64 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

20-DIP (0.300", 7.62mm)

Supplier Device Package

20-DIP

Manufacturer

NXP USA Inc.

Series

HC05

Core Processor

HC05

Core Size

8-Bit

Speed

4MHz

Connectivity

-

Peripherals

POR, WDT

Number of I/O

14

Program Memory Size

1.2KB (1.2K x 8)

Program Memory Type

OTP

EEPROM Size

-

RAM Size

64 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-SOIC (0.295", 7.50mm Width)

Supplier Device Package

20-SOIC