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| Datasheet | MCZ33905DD5EK |
| File Size | 2,814.91 KB |
| Total Pages | 107 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 28 part numbers |
| Associated Parts | MCZ33905DD5EK, MCZ33905DD3EK, MCZ33903DD5EK, MCZ33903DD3EK, MCZ33905DS5EK, MCZ33905DS3EK, MCZ33903DS5EK, MCZ33903DS3EK, MCZ33903D5EK, MCZ33903D3EK, MCZ33904D5EK, MCZ33904D3EK, MCZ33903DP5EK, MCZ33903DP3EK, MCZ33905DD5EKR2, MCZ33905DD3EKR2, MCZ33903DD5EKR2, MCZ33903DD3EKR2, MCZ33905DS5EKR2, MCZ33905DS3EKR2, MCZ33903DS5EKR2, MCZ33903DS3EKR2, MCZ33903D5EKR2, MCZ33903D3EKR2, MCZ33904D5EKR2, MCZ33904D3EKR2, MCZ33903DP5EKR2, MCZ33903DP3EKR2 |
| Description | SYSTEM BASIS CHIP 2 LIN 2X 5.0, SYSTEM BASIS CHIP 2 LIN 2X 3.3, SYSTEM BASIS CHIP 2 LIN 2X 5.0, SYSTEM BASIS CHIP 2 LIN 2X 3.3, SYSTEM BASIS CHIP LIN 2X 5.0 V |
MCZ33905DD5EK - NXP
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URL Link
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Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN, LIN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |
Manufacturer NXP USA Inc. Series - Applications System Basis Chip Interface CAN Voltage - Supply 5.5V ~ 28V Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 32-SOIC-EP Mounting Type Surface Mount |