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| Datasheet | MKL03Z32CBF4R |
| File Size | 1,098.67 KB |
| Total Pages | 59 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 6 part numbers |
| Associated Parts | MKL03Z32CBF4R, MKL03Z32VFK4R, MKL03Z32VFG4R, MKL03Z16VFG4R, MKL03Z8VFG4R, MKL03Z16VFK4R |
| Description | IC MCU 32BIT 32KB FLASH 20WLCSP, IC MCU 32BIT 32KB FLASH 24QFN, IC MCU 32BIT 32KB FLASH 16QFN, IC MCU 32BIT 16KB FLASH 16QFN, IC MCU 32BIT 8KB FLASH 16QFN |
MKL03Z32CBF4R - NXP
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Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O - Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-XFBGA, WLCSP Supplier Device Package 20-WLCSP (2x1.61) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 22 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-QFN (4x4) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 14 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-UFQFN Exposed Pad Supplier Device Package 16-QFN (3x3) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 14 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-UFQFN Exposed Pad Supplier Device Package 16-QFN (3x3) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 14 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 16-UFQFN Exposed Pad Supplier Device Package 16-QFN (3x3) |
Manufacturer NXP USA Inc. Series Kinetis KL03 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O 22 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 2K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 7x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 24-VFQFN Exposed Pad Supplier Device Package 24-QFN (4x4) |