Datasheet | MKL27Z32VDA4 |
File Size | 2,001.07 KB |
Total Pages | 102 |
Manufacturer | NXP |
Website | |
Total Parts | This datasheet covers 8 part numbers |
Associated Parts | MKL27Z32VDA4, MKL27Z64VDA4R, MKL27Z64VLH4R, MKL27Z64VLH4, MKL27Z64VDA4, MKL27Z32VLH4, MKL27Z32VFM4, MKL27Z64VFM4 |
Description | IC MCU 32BIT 32KB FLASH 36XFBGA, IC MCU 32BIT 64KB FLASH 36XFBGA, IC MCU 32BIT 64KB FLASH 64LQFP, IC MCU 32BIT 64KB FLASH 64LQFP, IC MCU 32BIT 64KB FLASH 36XFBGA |
MKL27Z32VDA4 - NXP
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NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 30 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 14x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 36-XFBGA Supplier Device Package 36-XFBGA (3.5x3.5) |
NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 30 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 14x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 36-XFBGA Supplier Device Package 36-XFBGA (3.5x3.5) |
NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 51 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 17x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 51 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 17x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 30 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 14x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 36-XFBGA Supplier Device Package 36-XFBGA (3.5x3.5) |
NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 51 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 17x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 64-LQFP Supplier Device Package 64-LQFP (10x10) |
NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 24 Program Memory Size 32KB (32K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 8K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 8x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 32-UFQFN Exposed Pad Supplier Device Package 32-QFN (5x5) |
NXP Manufacturer NXP USA Inc. Series Kinetis KL2 Core Processor ARM® Cortex®-M0+ Core Size 32-Bit Speed 48MHz Connectivity I²C, FlexIO, SPI, UART/USART, USB Peripherals DMA, I²S, PWM, WDT Number of I/O 24 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V Data Converters A/D 8x16b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 32-UFQFN Exposed Pad Supplier Device Package 32-QFN (5x5) |