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| Datasheet | MM908E625ACDWB |
| File Size | 1,134.91 KB |
| Total Pages | 49 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 4 part numbers |
| Associated Parts | MM908E625ACDWB, MM908E625ACEK, MM908E625ACPEKR2, MM908E625ACPEK |
| Description | IC QUAD HALF BRDG MCU/LIN 54SOIC, IC HALF-BRIDGE QUAD 54-SOIC, IC QUAD HALF-BRIDGE 54SOIC, IC QUAD HALF-BRIDGE 54SOIC |
MM908E625ACDWB - NXP
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Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |
Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |
Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |
Manufacturer NXP USA Inc. Series - Applications Automotive Mirror Control Core Processor HC08 Program Memory Type FLASH (16KB) Controller Series 908E RAM Size 512 x 8 Interface SCI, SPI Number of I/O 13 Voltage - Supply 8V ~ 18V Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package 54-SOIC-EP |