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| Datasheet | P89LPC9251FDH,112 |
| File Size | 430.95 KB |
| Total Pages | 75 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 6 part numbers |
| Associated Parts | P89LPC9251FDH,112, P89LPC9241FDH,112, P89LPC922A1FN,112, P89LPC922A1FDH,112, P89LPC9211FDH,112, P89LPC9201FDH,112 |
| Description | IC MCU 8BIT 8KB FLASH 20TSSOP, IC MCU 8BIT 4KB FLASH 20TSSOP, IC MCU 8BIT 8KB FLASH 20DIP, IC MCU 8BIT 8KB FLASH 20TSSOP, IC MCU 8BIT 4KB FLASH 20TSSOP |
P89LPC9251FDH,112 - NXP
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Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 4x8b; D/A 1x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |
Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 4x8b; D/A 1x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |
Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Through Hole Package / Case 20-DIP (0.300", 7.62mm) Supplier Device Package 20-DIP |
Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |
Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |
Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 18 Program Memory Size 2KB (2K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package 20-TSSOP |