Datasheet | P89LPC933HDH,512 |
File Size | 537.78 KB |
Total Pages | 77 |
Manufacturer | NXP |
Website | |
Total Parts | This datasheet covers 10 part numbers |
Associated Parts | P89LPC933HDH,512, P89LPC936FA,529, P89LPC935FHN,151, P89LPC936FDH,529, P89LPC934FDH,529, P89LPC933FDH,529, P89LPC935FDH,529, P89LPC935FA,129, P89LPC935FDH,518, P89LPC936FDH,518 |
Description | IC MCU 8BIT 4KB FLASH 28TSSOP, IC MCU 8BIT 16KB FLASH 28PLCC, IC MCU 8BIT 8KB FLASH 28HVQFN, IC MCU 8BIT 16KB FLASH 28TSSOP, IC MCU 8BIT 8KB FLASH 28TSSOP |
P89LPC933HDH,512 - NXP
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NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 4x8b; D/A 1x8b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package 28-TSSOP |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x8b; D/A 2x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-LCC (J-Lead) Supplier Device Package 28-PLCC (11.51x11.51) |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 12MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x8b; D/A 2x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-VQFN Exposed Pad Supplier Device Package 28-HVQFN (6x6) |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x8b; D/A 2x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package 28-TSSOP |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 4x8b; D/A 1x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package 28-TSSOP |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 4KB (4K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 4x8b; D/A 1x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package 28-TSSOP |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 12MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x8b; D/A 2x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package 28-TSSOP |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 12MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x8b; D/A 2x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-LCC (J-Lead) Supplier Device Package 28-PLCC (11.51x11.51) |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 12MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 8KB (8K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x8b; D/A 2x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package 28-TSSOP |
NXP Manufacturer NXP USA Inc. Series LPC900 Core Processor 8051 Core Size 8-Bit Speed 18MHz Connectivity I²C, SPI, UART/USART Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O 26 Program Memory Size 16KB (16K x 8) Program Memory Type FLASH EEPROM Size 512 x 8 RAM Size 768 x 8 Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V Data Converters A/D 8x8b; D/A 2x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package 28-TSSOP |