Datasheet | S1C17704F401100 |
File Size | 143.8 KB |
Total Pages | 3 |
Manufacturer | Epson Electronics |
Website | |
Total Parts | This datasheet covers 6 part numbers |
Associated Parts | S1C17704F401100, S1C17704F101100, S1C17704B403100, S1C17704B103100, S1C17704B402100, S1C17704B102100 |
Description | IC MCU 16BIT 64KB FLASH 144TQFP, IC MCU 16BIT 64KB FLASH 144TQFP, IC MCU 16BIT 64KB FLASH 144VFBGA, IC MCU 16BIT 64KB FLASH 144VFBGA, IC MCU 16BIT 64KB FLASH 161VFBGA |
S1C17704F401100 - Epson Electronics
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URL Link
Epson Electronics Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 8.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -20°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 144-TQFP Supplier Device Package - |
Epson Electronics Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 8.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -20°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 144-TQFP Supplier Device Package - |
Epson Electronics Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 8.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -20°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 144-VFBGA Supplier Device Package - |
Epson Electronics Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 8.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -20°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 144-VFBGA Supplier Device Package - |
Epson Electronics Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 8.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -20°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 161-VFBGA Supplier Device Package 161-VFBGA (7x7) |
Epson Electronics Manufacturer Epson Electronics America Inc-Semiconductor Div Series - Core Processor S1C17 Core Size 16-Bit Speed 8.2MHz Connectivity I²C, IrDA, SPI, UART/USART Peripherals LCD, PWM, WDT Number of I/O 28 Program Memory Size 64KB (64K x 8) Program Memory Type FLASH EEPROM Size - RAM Size 4K x 8 Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V Data Converters - Oscillator Type Internal Operating Temperature -20°C ~ 70°C (TA) Mounting Type Surface Mount Package / Case 161-VFBGA Supplier Device Package 161-VFBGA (7x7) |