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XCZU3EG-3SFVC784E - Xilinx
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Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 784-BFBGA, FCBGA Supplier Device Package 784-FCBGA (23x23) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 625-BFBGA, FCBGA Supplier Device Package 625-FCBGA (21x21) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 484-BFBGA, FCBGA Supplier Device Package 484-FCBGA (19x19) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EV Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FCBGA (40x40) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EV Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1517-BBGA, FCBGA Supplier Device Package 1517-FCBGA (40x40) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 667MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EG Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 533MHz, 600MHz, 1.3GHz Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 1156-BBGA, FCBGA Supplier Device Package 1156-FCBGA (35x35) |
Manufacturer Xilinx Inc. Series Zynq® UltraScale+™ MPSoC EV Architecture MCU, FPGA Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Flash Size - RAM Size 256KB Peripherals DMA, WDT Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed 600MHz, 1.5GHz Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Operating Temperature 0°C ~ 100°C (TJ) Package / Case 900-BBGA, FCBGA Supplier Device Package 900-FCBGA (31x31) |