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| Part Number | ECB130ABDCN-Y3 |
| OEMstron Part # | ECB130ABDCN-Y3 |
| Manufacturer | Micron Technology Inc. |
| Category | Semiconductors › Memory ICs › Memory |
| Description | LPDDR2 1G DIE 32MX32 |
| Lifecycle | Obsolete |
| RoHS | No RoHS Information |
| EDA/CAD Models | ECB130ABDCN-Y3 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | Nov 24 - Nov 29 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
ECB130ABDCN-Y3 Specifications
| Part Number | ECB130ABDCN-Y3 | |
| Brand | Micron Technology Inc. | |
| Lifecycle | Obsolete | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Memory ICs | |
| Subcategory | Memory | |
| Manufacturer | Micron Technology Inc. | |
| Series | * | |
| Memory Type | - | |
| Memory Format | - | |
| Technology | - | |
| Memory Size | - | |
| Memory Interface | - | |
| Clock Frequency | - | |
| Write Cycle Time - Word, Page | - | |
| Access Time | - | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Mounting Type | - | |
| Package / Case | - | |
| Supplier Device Package | - |
ECB130ABDCN-Y3 Documents
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Global Supply Chains - Reliable and Authorized Distributor Resources
| Part Number | Description | Stock |
|
ECB130ABDCN-Y3 D# V36:1790_07218794 Micron Technology Inc |
LPDDR2 32MX32 DIE-COM 1.2V RoHS: Compliant
|
Americas - 0 |
| Part Number | Description | Stock |
|
ECB130ABDCN-Y3 D# ECB130ABDCN-Y3 Micron Technology Inc |
LPDDR2 1G DIE 32MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECB130ABDCN-Y3) RoHS: Compliant
|
Americas - 0 |
| Part Number | Description | Stock |
|
ECB130ABDCN-Y3 D# ECB130ABDCN-Y3-ND Micron Technology Inc |
LPDDR2 1G DIE 32MX32 |
Limited Supply - Call |
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