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ECF840AAACN-C1-Y3

ECF840AAACN-C1-Y3
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Part Number ECF840AAACN-C1-Y3
OEMstron Part # ECF840AAACN-C1-Y3
Manufacturer Micron Technology Inc.
Category SemiconductorsMemory ICsMemory
Description IC DRAM 8G PARALLEL
Lifecycle Obsolete
RoHS No RoHS Information
EDA/CAD Models ECF840AAACN-C1-Y3 PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Mar 29 - Apr 3 (Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

ECF840AAACN-C1-Y3 Specifications

Part Number ECF840AAACN-C1-Y3
Brand Micron Technology Inc.
Lifecycle Obsolete
RoHS No RoHS Information
Product Line Semiconductors
Category Memory ICs
Subcategory Memory
Manufacturer Micron Technology Inc.
Series -
Memory Type Volatile
Memory Format DRAM
Technology SDRAM - Mobile LPDDR3
Memory Size 8Gb (512M x 16)
Memory Interface Parallel
Clock Frequency -
Write Cycle Time - Word, Page -
Access Time -
Voltage - Supply 1.14V ~ 1.95V
Operating Temperature -
Mounting Type -
Package / Case -
Supplier Device Package -

ECF840AAACN-C1-Y3 Documents

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Part Number Description Stock

ECF840AAACN-C1-Y3

D# ECF840AAACN-C1-Y3

Micron Technology Inc

LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3)

RoHS: Compliant
Americas - 0

ECF840AAACN-C1-Y3-ES

D# ECF840AAACN-C1-Y3-ES

Micron Technology Inc

LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3-ES)

RoHS: Compliant
Americas - 0
Part Number Description Stock

ECF840AAACN-C1-Y3

D# ECF840AAACN-C1-Y3-ND

Micron Technology Inc

IC DRAM 8GBIT PARALLEL

Limited Supply - Call

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