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Part Number | ECF840AAACN-C2-Y3 |
OEMstron Part # | ECF840AAACN-C2-Y3 |
Manufacturer | Micron Technology Inc. |
Category | Semiconductors › Memory ICs › Memory |
Description | IC DRAM 8G PARALLEL |
Lifecycle | Obsolete |
RoHS | No RoHS Information |
EDA/CAD Models | ECF840AAACN-C2-Y3 PCB Footprint and Symbol |
Warehouses | USA, Europe, China, Hong Kong SAR |
Estimated Delivery | Feb 1 - Feb 6 (Choose Expedited Shipping) |
Warranty | Up to 1 year [Limited-Warranty]* |
Payment | |
Shipping |
ECF840AAACN-C2-Y3 Specifications
Part Number | ECF840AAACN-C2-Y3 | |
Brand | Micron Technology Inc. | |
Lifecycle | Obsolete | |
RoHS | No RoHS Information | |
Product Line | Semiconductors | |
Category | Memory ICs | |
Subcategory | Memory | |
Manufacturer | Micron Technology Inc. | |
Series | - | |
Memory Type | Volatile | |
Memory Format | DRAM | |
Technology | SDRAM - Mobile LPDDR3 | |
Memory Size | 8Gb (512M x 16) | |
Memory Interface | Parallel | |
Clock Frequency | - | |
Write Cycle Time - Word, Page | - | |
Access Time | - | |
Voltage - Supply | 1.14V ~ 1.95V | |
Operating Temperature | - | |
Mounting Type | - | |
Package / Case | - | |
Supplier Device Package | - |
ECF840AAACN-C2-Y3 Documents
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Global Supply Chains - Reliable and Authorized Distributor Resources
Part Number | Description | Stock |
ECF840AAACN-C2-Y3-ES D# ECF840AAACN-C2-Y3-ES Micron Technology Inc |
LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C2-Y3-ES) RoHS: Compliant
|
Americas - 0 |
Part Number | Description | Stock |
ECF840AAACN-C2-Y3 D# ECF840AAACN-C2-Y3-ND Micron Technology Inc |
IC DRAM 8GBIT PARALLEL |
Limited Supply - Call |
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