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MT29F256G08EBCAGB16A3WC1-M

MT29F256G08EBCAGB16A3WC1-M
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Part Number MT29F256G08EBCAGB16A3WC1-M
OEMstron Part # MT29F256G08EBCAGB16A3WC1-M
Manufacturer Micron Technology Inc.
Category SemiconductorsMemory ICsMemory
Description TLC 256G DIE 32GX8
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models MT29F256G08EBCAGB16A3WC1-M PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery Mar 24 - Mar 29 (Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

MT29F256G08EBCAGB16A3WC1-M Specifications

Part Number MT29F256G08EBCAGB16A3WC1-M
Brand Micron Technology Inc.
Lifecycle Active
RoHS No RoHS Information
Product Line Semiconductors
Category Memory ICs
Subcategory Memory
Manufacturer Micron Technology Inc.
Series *
Memory Type -
Memory Format -
Technology -
Memory Size -
Memory Interface -
Clock Frequency -
Write Cycle Time - Word, Page -
Access Time -
Voltage - Supply -
Operating Temperature -
Mounting Type -
Package / Case -
Supplier Device Package -

MT29F256G08EBCAGB16A3WC1-M Documents

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Part Number Description Stock

MT29F256G08EBCAGB16A3WC1-M

D# V36:1790_18500077

Micron Technology Inc

128Gb to 1Tb Asynchronous/Synchronous NAND

RoHS: Compliant
Americas - 0
Part Number Description Stock

MT29F256G08EBCAGB16A3WC1-M

D# MT29F256G08EBCAGB16A3WC1-M

Micron Technology Inc

MICMT29F256G08EBCAGB16A3WC1-M 32GX8 NAND - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MT29F256G08EBCAGB16A3WC1-M)

RoHS: Compliant
Americas - 0
Part Number Description Stock

MT29F256G08EBCAGB16A3WC1-M

D# MT29F256G08EBCAGB16A3WC1-M-ND

Micron Technology Inc

TLC 256G DIE 32GX8

Temporarily Out of Stock

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