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Part Number | MT29F256G08EBHAFB16A3WSA |
OEMstron Part # | MT29F256G08EBHAFB16A3WSA |
Manufacturer | Micron Technology Inc. |
Category | Semiconductors › Memory ICs › Memory |
Description | TLC 256G DIE 32GX8 |
Lifecycle | Active |
RoHS | No RoHS Information |
EDA/CAD Models | MT29F256G08EBHAFB16A3WSA PCB Footprint and Symbol |
Warehouses | USA, Europe, China, Hong Kong SAR |
Estimated Delivery | Feb 2 - Feb 7 (Choose Expedited Shipping) |
Warranty | Up to 1 year [Limited-Warranty]* |
Payment | |
Shipping |
MT29F256G08EBHAFB16A3WSA Specifications
Part Number | MT29F256G08EBHAFB16A3WSA | |
Brand | Micron Technology Inc. | |
Lifecycle | Active | |
RoHS | No RoHS Information | |
Product Line | Semiconductors | |
Category | Memory ICs | |
Subcategory | Memory | |
Manufacturer | Micron Technology Inc. | |
Series | * | |
Memory Type | - | |
Memory Format | - | |
Technology | - | |
Memory Size | - | |
Memory Interface | - | |
Clock Frequency | - | |
Write Cycle Time - Word, Page | - | |
Access Time | - | |
Voltage - Supply | - | |
Operating Temperature | - | |
Mounting Type | - | |
Package / Case | - | |
Supplier Device Package | - |
MT29F256G08EBHAFB16A3WSA Documents
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Part Number | Description | Stock |
MT29F256G08EBHAFB16A3WSA D# MT29F256G08EBHAFB16A3WSA Micron Technology Inc |
TLC 256G DIE 32GX8 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MT29F256G08EBHAFB16A3WSA) RoHS: Compliant
|
Americas - 0 |
Part Number | Description | Stock |
MT29F256G08EBHAFB16A3WSA D# MT29F256G08EBHAFB16A3WSA-ND Micron Technology Inc |
TLC 256G DIE 32GX8 |
Temporarily Out of Stock |
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