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Part Number | MT52L256M32D1V01MWC2 MS |
OEMstron Part # | MT52L256M32D1V01MWC2-MS |
Manufacturer | Micron Technology Inc. |
Category | Semiconductors › Memory ICs › Memory |
Description | LPDDR3 8G DIE 256MX32 |
Lifecycle | Active |
RoHS | No RoHS Information |
EDA/CAD Models | MT52L256M32D1V01MWC2 MS PCB Footprint and Symbol |
Warehouses | USA, Europe, China, Hong Kong SAR |
Estimated Delivery | Nov 30 - Dec 5 (Choose Expedited Shipping) |
Warranty | Up to 1 year [Limited-Warranty]* |
Payment | |
Shipping |
MT52L256M32D1V01MWC2 MS Specifications
Part Number | MT52L256M32D1V01MWC2 MS | |
Brand | Micron Technology Inc. | |
Lifecycle | Active | |
RoHS | No RoHS Information | |
Product Line | Semiconductors | |
Category | Memory ICs | |
Subcategory | Memory | |
Manufacturer | Micron Technology Inc. | |
Series | * | |
Memory Type | - | |
Memory Format | - | |
Technology | - | |
Memory Size | - | |
Memory Interface | - | |
Clock Frequency | - | |
Write Cycle Time - Word, Page | - | |
Access Time | - | |
Voltage - Supply | - | |
Operating Temperature | - | |
Mounting Type | - | |
Package / Case | - | |
Supplier Device Package | - |
MT52L256M32D1V01MWC2 MS Documents
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Part Number | Description | Stock |
MT52L256M32D1V01MWC2 MS D# MT52L256M32D1V01MWC2 MS Micron Technology Inc |
LPDDR3 8G DIE X32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MT52L256M32D1V01MWC2 MS) RoHS: Compliant
|
Americas - 0 |
Part Number | Description | Stock |
MT52L256M32D1V01MWC2 MS D# MT52L256M32D1V01MWC2MS-ND Micron Technology Inc |
LPDDR3 8G DIE 256MX32 |
Temporarily Out of Stock |
Part Number | Description | Stock |
MT52L256M32D1V01MWC2MS Micron Technology Inc |
OEM/CM QUOTES ONLY | NO BROKERS |
23200 |
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