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Part Number | TH58BYG3S0HBAI6 |
OEMstron Part # | TH58BYG3S0HBAI6 |
Manufacturer | Toshiba Memory America, Inc. |
Category | Semiconductors › Memory ICs › Memory |
Description | 8GB SLC NAND 24NM BGA 6.5X8 1.8V |
Lifecycle | Active |
RoHS | No RoHS Information |
EDA/CAD Models | TH58BYG3S0HBAI6 PCB Footprint and Symbol |
Warehouses | USA, Europe, China, Hong Kong SAR |
Estimated Delivery | Feb 1 - Feb 6 (Choose Expedited Shipping) |
Warranty | Up to 1 year [Limited-Warranty]* |
Payment | |
Shipping |
TH58BYG3S0HBAI6 Specifications
Part Number | TH58BYG3S0HBAI6 | |
Brand | Toshiba Memory America, Inc. | |
Lifecycle | Active | |
RoHS | No RoHS Information | |
Product Line | Semiconductors | |
Category | Memory ICs | |
Subcategory | Memory | |
Manufacturer | Toshiba Memory America, Inc. | |
Series | Benand™ | |
Memory Type | Non-Volatile | |
Memory Format | FLASH | |
Technology | FLASH - NAND (SLC) | |
Memory Size | 8Gb (1G x 8) | |
Memory Interface | - | |
Clock Frequency | - | |
Write Cycle Time - Word, Page | 25ns | |
Access Time | - | |
Voltage - Supply | 1.7V ~ 1.95V | |
Operating Temperature | -40°C ~ 85°C (TA) | |
Mounting Type | Surface Mount | |
Package / Case | 67-VFBGA | |
Supplier Device Package | 67-VFBGA (6.5x8) |
TH58BYG3S0HBAI6 Documents
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