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Embedded Processors & Controllers

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M2S150TS-FCG1152I
M2S150TS-FCG1152I

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 1152BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
In Stock177

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M2S150TS-FCS536
M2S150TS-FCS536

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock287

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M2S150TS-FCS536I
M2S150TS-FCS536I

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock324

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M2S150TS-FCSG536
M2S150TS-FCSG536

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock113

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M2S150TS-FCSG536I
M2S150TS-FCSG536I

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 536BGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 536-LFBGA, CSPBGA
  • Supplier Device Package: 536-CSPBGA (16x16)
In Stock396

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M2S150TS-FCV484
M2S150TS-FCV484

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BFBGA
  • Supplier Device Package: 484-FBGA (19x19)
In Stock270

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M2S150TS-FCV484I
M2S150TS-FCV484I

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BFBGA
  • Supplier Device Package: 484-FBGA (19x19)
In Stock237

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M2S150TS-FCVG484
M2S150TS-FCVG484

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BFBGA
  • Supplier Device Package: 484-FBGA (19x19)
In Stock308

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M2S150TS-FCVG484I
M2S150TS-FCVG484I

Microsemi

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-M3 166MHZ 484FBGA

  • Manufacturer: Microsemi Corporation
  • Series: SmartFusion®2
  • Architecture: MCU, FPGA
  • Core Processor: ARM® Cortex®-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BFBGA
  • Supplier Device Package: 484-FBGA (19x19)
In Stock500

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R8A77610DA01BGV
R8A77610DA01BGV

Renesas Electronics America

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC SH-4A 400MHZ 449BGA

  • Manufacturer: Renesas Electronics America
  • Architecture: MPU
  • Core Processor: SH-4A
  • RAM Size: 16KB
  • Peripherals: DDR
  • Connectivity: CANbus, I²C, SCI, SD, SSI, USB
  • Speed: 400MHz
  • Package / Case: 449-BGA
  • Supplier Device Package: 449-BGA (21x21)
In Stock394

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R8A77610DA01BGV#W9
R8A77610DA01BGV#W9

Renesas Electronics America

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC SH-4A 400MHZ 449BGA

  • Manufacturer: Renesas Electronics America
  • Architecture: MPU
  • Core Processor: SH-4A
  • RAM Size: 16KB
  • Peripherals: DDR
  • Connectivity: CANbus, I²C, SCI, SD, SSI, USB
  • Speed: 400MHz
  • Package / Case: 449-BGA
  • Supplier Device Package: 449-BGA (21x21)
In Stock464

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R8A77610DA01BGV#YC
R8A77610DA01BGV#YC

Renesas Electronics America

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC SH-4A 400MHZ 449BGA

  • Manufacturer: Renesas Electronics America
  • Architecture: MPU
  • Core Processor: SH-4A
  • RAM Size: 16KB
  • Peripherals: DDR
  • Connectivity: CANbus, I²C, SCI, SD, SSI, USB
  • Speed: 400MHz
  • Package / Case: 449-BGA
  • Supplier Device Package: 449-BGA (21x21)
In Stock126

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R8A77610DA01BGV#YD
R8A77610DA01BGV#YD

Renesas Electronics America

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC SH-4A 400MHZ 449BGA

  • Manufacturer: Renesas Electronics America
  • Architecture: MPU
  • Core Processor: SH-4A
  • RAM Size: 16KB
  • Peripherals: DDR
  • Connectivity: CANbus, I²C, SCI, SD, SSI, USB
  • Speed: 400MHz
  • Package / Case: 449-BGA
  • Supplier Device Package: 449-BGA (21x21)
In Stock167

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R8A77610DA01BGV#YE
R8A77610DA01BGV#YE

Renesas Electronics America

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC SH-4A 400MHZ 449BGA

  • Manufacturer: Renesas Electronics America
  • Architecture: MPU
  • Core Processor: SH-4A
  • RAM Size: 16KB
  • Peripherals: DDR
  • Connectivity: CANbus, I²C, SCI, SD, SSI, USB
  • Speed: 400MHz
  • Package / Case: 449-BGA
  • Supplier Device Package: 449-BGA (21x21)
In Stock301

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R8A77610DA01BGV#YF
R8A77610DA01BGV#YF

Renesas Electronics America

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC SH-4A 400MHZ 449BGA

  • Manufacturer: Renesas Electronics America
  • Architecture: MPU
  • Core Processor: SH-4A
  • RAM Size: 16KB
  • Peripherals: DDR
  • Connectivity: CANbus, I²C, SCI, SD, SSI, USB
  • Speed: 400MHz
  • Package / Case: 449-BGA
  • Supplier Device Package: 449-BGA (21x21)
In Stock358

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XA7Z010-1CLG225Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 225BGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
In Stock449

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XA7Z010-1CLG400I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 400BGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
In Stock486

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XA7Z010-1CLG400Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 400BGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
In Stock224

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XA7Z020-1CLG400I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 400BGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
In Stock229

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XA7Z020-1CLG400Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 400BGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
In Stock284

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XA7Z020-1CLG484Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 484BGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
In Stock757

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XA7Z030-1FBG484I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 484FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
In Stock451

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XA7Z030-1FBG484Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 484FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
In Stock109

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XA7Z030-1FBV484Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 484FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Automotive, AEC-Q100, Zynq®-7000 XA
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
In Stock181

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XAZU2EG-1SBVA484Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 484FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 1.2MB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, I²C, SPI, UART/USART, USB
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BFBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
In Stock437

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XAZU2EG-1SFVA625I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 625FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 1.2MB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, I²C, SPI, UART/USART, USB
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
In Stock251

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XAZU2EG-1SFVA625Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 625FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 1.2MB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, I²C, SPI, UART/USART, USB
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
In Stock144

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XAZU2EG-1SFVC784I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 1.2MB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, I²C, SPI, UART/USART, USB
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
In Stock481

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XAZU2EG-1SFVC784Q

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 784FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 1.2MB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, I²C, SPI, UART/USART, USB
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 784-BFBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
In Stock308

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XAZU2EG-L1SFVA625I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 625FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 1.2MB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, I²C, SPI, UART/USART, USB
  • Speed: 500MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
In Stock440

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