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Embedded Processors & Controllers

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XC7Z045-2FBG676CES

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock242

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XC7Z045-2FBG676E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock276

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XC7Z045-2FBG676I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock328

More on Order

XC7Z045-2FF676I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock138

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XC7Z045-2FF900E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock255

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XC7Z045-2FF900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock321

More on Order

XC7Z045-2FFG676E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock356

More on Order

XC7Z045-2FFG676I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock315

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XC7Z045-2FFG900CES

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock230

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XC7Z045-2FFG900E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock397

More on Order

XC7Z045-2FFG900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock517

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XC7Z045-3FBG676E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 1GHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1GHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock133

More on Order

XC7Z045-3FFG676E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 1GHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1GHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock364

More on Order

XC7Z045-3FFG900E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 1GHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1GHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock490

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XC7Z045-3FFV676E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 1GHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1GHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock159

More on Order

XC7Z045-L2FBG676I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock196

More on Order

XC7Z045-L2FFG676I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
In Stock198

More on Order

XC7Z045-L2FFG900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock288

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XC7Z100-1FF900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock216

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XC7Z100-1FFG1156I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 1156BGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock280

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XC7Z100-1FFG900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 667MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock398

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XC7Z100-2FF900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock301

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XC7Z100-2FFG1156I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 1156BGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock480

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XC7Z100-2FFG900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock417

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XC7Z100-L2FFG1156I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 1156BGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock420

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XC7Z100-L2FFG900I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq®-7000
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
In Stock176

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XCZU11EG-1FFVB1517E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock466

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XCZU11EG-1FFVB1517I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 1517FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
In Stock126

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XCZU11EG-1FFVC1156E

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock282

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XCZU11EG-1FFVC1156I

Embedded Processors & Controllers - SoC (System On Chip)

IC SOC CORTEX-A53 1156FCBGA

  • Manufacturer: Xilinx Inc.
  • Series: Zynq® UltraScale+™ MPSoC EG
  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 500MHz, 600MHz, 1.2GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
In Stock410

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