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CategorySemiconductors / Embedded Processors & Controllers / SoC (System On Chip)

Records 2,134

Page 3/72

Part Number	Manufacturer	Description	In Stock	Series	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
5CSXFC2C6U23C8N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 672UBGA	In Stock449 More on Order	Series: Cyclone® V SX	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz	Primary Attributes: FPGA - 25K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 672-FBGA	Supplier Device Package: 672-UBGA (23x23)
M2S050-FGG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock453 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
5CSEBA5U23C8N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 672UBGA	In Stock524 More on Order	Series: Cyclone® V SE	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz	Primary Attributes: FPGA - 85K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 672-FBGA	Supplier Device Package: 672-UBGA (23x23)
5CSXFC4C6U23C8N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 672UBGA	In Stock470 More on Order	Series: Cyclone® V SX	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz	Primary Attributes: FPGA - 40K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 672-FBGA	Supplier Device Package: 672-UBGA (23x23)
5CSXFC5D6F31C8N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 896FBGA	In Stock383 More on Order	Series: Cyclone® V SX	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz	Primary Attributes: FPGA - 85K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
5CSEBA6U23C6N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 925MHZ 672UBGA	In Stock571 More on Order	Series: Cyclone® V SE	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 925MHz	Primary Attributes: FPGA - 110K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 672-FBGA	Supplier Device Package: 672-UBGA (23x23)
5CSTFD5D5F31I7N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA	In Stock280 More on Order	Series: Cyclone® V ST	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: FPGA - 85K Logic Elements	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
XCZU2EG-L1SFVA625I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock491 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MCU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 256KB	Peripherals: DMA, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 500MHz, 600MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
M2S005-VFG256	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256BGA	In Stock505 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 128KB	RAM Size: 64KB	Peripherals: DDR	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 5K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 256-LFBGA	Supplier Device Package: 256-VFPBGA (14x14)
M2S005-VFG256I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256BGA	In Stock515 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 128KB	RAM Size: 64KB	Peripherals: DDR	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 5K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 256-LFBGA	Supplier Device Package: 256-VFPBGA (14x14)
M2S005S-VFG256I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA	In Stock377 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 128KB	RAM Size: 64KB	Peripherals: DDR	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 5K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 256-LBGA	Supplier Device Package: 256-FPBGA (17x17)
M2S010-VFG256	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA	In Stock575 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 10K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 256-LBGA	Supplier Device Package: 256-FPBGA (17x17)
M2S010T-VFG256	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA	In Stock327 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 10K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 256-LBGA	Supplier Device Package: 256-FPBGA (17x17)
M2S025-FCSG325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock398 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 25K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S025T-VFG256	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 256FBGA	In Stock427 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 25K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 256-LBGA	Supplier Device Package: 256-FPBGA (17x17)
5CSEBA2U19I7SN	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 484UBGA	In Stock447 More on Order	Series: Cyclone® V SE	Architecture: MCU, FPGA	Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: FPGA - 25K Logic Elements	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-FBGA	Supplier Device Package: 484-UBGA (19x19)
M2S060-FCSG325I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 325BGA	In Stock445 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 60K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 325-TFBGA, CSPBGA	Supplier Device Package: 325-CSPBGA (11x11)
M2S050T-FGG484	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock324 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S050T-FGG896	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA	In Stock369 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 256KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 50K Logic Modules	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
M2S090-FGG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock460 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 90K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BGA	Supplier Device Package: 484-FPBGA (23x23)
M2S150-FCVG484I	Microsemi	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 484FBGA	In Stock488 More on Order	Series: SmartFusion®2	Architecture: MCU, FPGA	Core Processor: ARM® Cortex®-M3	Flash Size: 512KB	RAM Size: 64KB	Peripherals: DDR, PCIe, SERDES	Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB	Speed: 166MHz	Primary Attributes: FPGA - 150K Logic Modules	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 484-BFBGA	Supplier Device Package: 484-FBGA (19x19)
XAZU2EG-1SFVA625I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock251 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.2MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XAZU2EG-L1SFVA625I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock440 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.2MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XAZU2EG-L1SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock434 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.2MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
XAZU3EG-L1SFVA625I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 625FCBGA	In Stock233 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.8MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 625-BFBGA, FCBGA	Supplier Device Package: 625-FCBGA (21x21)
XAZU3EG-L1SFVC784I	Xilinx	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 784FCBGA	In Stock446 More on Order	Series: Zynq® UltraScale+™ MPSoC EG	Architecture: MPU, FPGA	Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	Flash Size: -	RAM Size: 1.8MB	Peripherals: DMA, WDT	Connectivity: CANbus, I²C, SPI, UART/USART, USB	Speed: 500MHz, 1.2GHz	Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 784-BFBGA, FCBGA	Supplier Device Package: 784-FCBGA (23x23)
5CSEMA5F31C8N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 600MHZ 896FBGA	In Stock371 More on Order	Series: Cyclone® V SE	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 600MHz	Primary Attributes: FPGA - 85K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
5CSEBA6U23C7N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA	In Stock513 More on Order	Series: Cyclone® V SE	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: FPGA - 110K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 672-FBGA	Supplier Device Package: 672-UBGA (23x23)
5CSEMA6F31C7N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 896FBGA	In Stock258 More on Order	Series: Cyclone® V SE	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: FPGA - 110K Logic Elements	Operating Temperature: 0°C ~ 85°C (TJ)	Package / Case: 896-BGA	Supplier Device Package: 896-FBGA (31x31)
5CSEMA6U23I7N	Intel	Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 672UBGA	In Stock491 More on Order	Series: Cyclone® V SE	Architecture: MCU, FPGA	Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	Flash Size: -	RAM Size: 64KB	Peripherals: DMA, POR, WDT	Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	Speed: 800MHz	Primary Attributes: FPGA - 110K Logic Elements	Operating Temperature: -40°C ~ 100°C (TJ)	Package / Case: 672-FBGA	Supplier Device Package: 672-UBGA (23x23)

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