Image |
Part Number |
Manufacturer |
Description |
In Stock |
Quantity |
Series | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA |
In Stock469 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1517-BBGA, FCBGA |
Supplier Device Package: 1517-FCBGA (40x40) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock124 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock401 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock319 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock129 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock396 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock287 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock353 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock465 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock319 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock349 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock402 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1156FCBGA |
In Stock152 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1156-BBGA, FCBGA |
Supplier Device Package: 1156-FCBGA (35x35) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA |
In Stock489 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1517-BBGA, FCBGA |
Supplier Device Package: 1517-FCBGA (40x40) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock452 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock358 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 500MHz, 600MHz, 1.2GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock460 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock193 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock365 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock488 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock141 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock217 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock393 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1517FCBGA |
In Stock379 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1517-BBGA, FCBGA |
Supplier Device Package: 1517-FCBGA (40x40) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock487 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock226 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock382 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock282 More on Order |
|
Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 533MHz, 600MHz, 1.3GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1760FCBGA |
In Stock365 More on Order |
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Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1760-BBGA, FCBGA |
Supplier Device Package: 1760-FCBGA (42.5x42.5) |
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Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A53 1924FCBGA |
In Stock167 More on Order |
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Series: Zynq® UltraScale+™ MPSoC EG |
Architecture: MCU, FPGA |
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA, WDT |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 600MHz, 667MHz, 1.5GHz |
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
Operating Temperature: 0°C ~ 100°C (TJ) |
Package / Case: 1924-BBGA, FCBGA |
Supplier Device Package: 1924-FCBGA (45x45) |