Image |
Part Number |
Manufacturer |
Description |
In Stock |
Quantity |
Series | Architecture | Core Processor | Flash Size | RAM Size | Peripherals | Connectivity | Speed | Primary Attributes | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA |
In Stock368 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 256FBGA |
In Stock430 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA |
In Stock294 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 256FBGA |
In Stock277 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 256-LBGA |
Supplier Device Package: 256-FPBGA (17x17) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP |
In Stock163 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock358 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock298 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock121 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock232 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP |
In Stock301 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock442 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP |
In Stock499 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP |
In Stock475 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP |
In Stock211 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP |
In Stock449 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock374 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock429 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 100MHZ 288CSP |
In Stock294 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 100MHz |
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock465 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 128KB |
RAM Size: 16KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock171 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 512KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 80MHZ 288CSP |
In Stock160 More on Order |
|
Series: SmartFusion® |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DMA, POR, WDT |
Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART |
Speed: 80MHz |
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
Operating Temperature: -40°C ~ 100°C (TJ) |
Package / Case: 288-TFBGA, CSPBGA |
Supplier Device Package: 288-CSP (11x11) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA |
In Stock393 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
|
|
Microsemi |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-M3 166MHZ 896FBGA |
In Stock426 More on Order |
|
Series: SmartFusion®2 |
Architecture: MCU, FPGA |
Core Processor: ARM® Cortex®-M3 |
Flash Size: 256KB |
RAM Size: 64KB |
Peripherals: DDR, PCIe, SERDES |
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Speed: 166MHz |
Primary Attributes: FPGA - 50K Logic Modules |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 896-BGA |
Supplier Device Package: 896-FBGA (31x31) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 400BGA |
In Stock257 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 667MHz |
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 400-LFBGA, CSPBGA |
Supplier Device Package: 400-CSPBGA (17x17) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 484BGA |
In Stock415 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 667MHz |
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-LFBGA, CSPBGA |
Supplier Device Package: 484-CSPBGA (19x19) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 766MHZ 400BGA |
In Stock397 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 766MHz |
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 400-LFBGA, CSPBGA |
Supplier Device Package: 400-CSPBGA (17x17) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 766MHZ 484BGA |
In Stock498 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 766MHz |
Primary Attributes: Artix™-7 FPGA, 85K Logic Cells |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 484-LFBGA, CSPBGA |
Supplier Device Package: 484-CSPBGA (19x19) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 900FCBGA |
In Stock276 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 667MHz |
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 900-BBGA, FCBGA |
Supplier Device Package: 900-FCBGA (31x31) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 667MHZ 676FCBGA |
In Stock450 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 667MHz |
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 676-BBGA, FCBGA |
Supplier Device Package: 676-FCBGA (27x27) |
|
|
Xilinx |
Embedded Processors & Controllers - SoC (System On Chip) IC SOC CORTEX-A9 800MHZ 900FCBGA |
In Stock230 More on Order |
|
Series: Zynq®-7000 |
Architecture: MCU, FPGA |
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size: - |
RAM Size: 256KB |
Peripherals: DMA |
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Speed: 800MHz |
Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells |
Operating Temperature: 0°C ~ 85°C (TJ) |
Package / Case: 900-BBGA, FCBGA |
Supplier Device Package: 900-FCBGA (31x31) |