ADI introduces breakthrough solutions that will accelerate the deployment of millimeter wave 5G wireless network infrastructure

Dec 1 2019 2019-12 Power Analog Devices

Analog Devices has introduced a new solution for millimeter wave (mmWave) 5G infrastructure with the highest level of integration yet, designed to reduce the design requirements and complexity of next-generation cellular network infrastructure. The solution integrates ADI's advanced beamforming ics, up/down conversion (UDC) and other mixed-signal circuits. This optimized beam-to-bit signal chain demonstrates a unique set of capabilities that only ADI can provide.

"Millimeter wave 5G is an emerging technology with great potential." "Designing these systems from scratch can be extremely difficult, balancing system-level challenges in terms of performance, standards and cost," said Karim Hamed, general manager of microwave communications at Analog Devices. "This new solution leverages ADI's industry-leading technology and long heritage in RF, microwave, and millimeter wave communications infrastructure, as well as deep expertise across RF to simplify customers' design processes, reduce the total number of components, and accelerate 5G deployment."

The new MMwave 5G chipset includes the 16-channel ADMV4821 dual/single-polarization beamforming IC, the 16-channel ADMV4801 single-polarization beamforming IC, and the ADMV1017 mmwave UDC. The 24 to 30 GHz beamforming + UDC solution constitutes a 3GPP 5G NR compliant millimeter wave front end with support for n261, n257 and n258 bands.

The high channel density, coupled with the ability to support single - and dual-polarization deployments, greatly enhances system flexibility and reconfigurability for multiple 5G use cases, while the best-in-class equivalent omnidirectional radiated Power (EIRP) extends radio coverage and density. ADI's legacy of strength in millimeter wave technology enables customers to leverage world-class application and system design to optimize a complete product line for thermal, RF, power and wiring considerations.

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