Allegro MicroSystems, LLC announced the launch of the next generation latch using Vertical Hall technology

     Allegro MicroSystems, LLC announced the introduction of a new vertical Hall effect sensor IC, a magnetic induction device with excellent thermal stability and stress resistance that is ideal for use in harsh operating environments.

     The Allegro A1260 is driven by alternating north and South Pole magnetic fields, which are in the same plane as the imprint of the device, rather than perpendicular to the imprint as is the case with conventional Hall effect sensors. This enables system designers to adopt new mechanical configurations that are not available with traditional flat surface Hall sensors, including the replacement of through-hole SIP devices with miniature surface-mount SOT23 ics to save space and cost.

     The A1260 has been optimized for speed and position sensing of toroidal magnets (motors/encoders) or moving/rotating components and is primarily targeted at the automotive, communications, consumer and industrial markets. Key applications include motor commutation and speed and direction sensing for devices such as window lifters, sunroofs and backdoors/hatchbacks, white goods, automatic shutters, garage door openers and sliding doors.

     Each device is equipped with a voltage regulator, Hall voltage generator, small signal amplifier, stable chopper, Schmidt trigger and NMOS output capable of absorbing up to 25 mA of current on a single silicon chip. Onboard regulators allow operation with supply voltages from 3 V to 24 V, while also increasing reliability to EMC standards, for example, improving protection against high-voltage transient events. The A1260 meets the requirements of the AEC-Q100 standard and also features Zener clamp protection, output short circuit protection and battery reverse connection protection. Dynamic offset elimination reduces residual offset voltage, which is usually caused by device overdie pressure, temperature dependence and thermal stress, resulting in excellent thermal stability.

     The device is highly sensitive (BOP = 25G typical), so the magnetic operation characteristics can be specified over the operating voltage and temperature range. The LH type package is an improved SOT23W surface-mount package that utilizes a magnetic field switch perpendicular to the pin-free edge of the package. The UA type package is an ultra-miniature SIP with through-hole mounting and lead forming that switches when a magnetic field appears at the top edge of the package (parallel to the imprint). Both packages meet the requirements of the RoHS directive and are lead-free (Pb) packages (suffix -T) with 100% mist tin plating for the pin frame.