Amphenol introduces a series of solderless compression mounting connectors to meet the technical challenges of 56G and 112G systems

     Amphenol Ardent Concepts has introduced its latest line of solderless compression mounting connectors, the micro-LinkOVER series. It is an OverPass two-axle connector system that provides system designers and layout engineers with a cost-effective way to unlock the design flexibility needed to manage the technical challenges of 56G and 112G systems and beyond.

     Micro-LinkOVER supports PAM4 signaling speeds of 10Gb/s, 28Gb/s, 56Gb/s, and 112Gb/s per channel, with a high signal-to-noise ratio and low VSWR. Its direct-to-PCB compression mounting solution eliminates any lossy paddle cards, minimizing transitions and losses to the system budget. The modular design of the micro-LinkOVER allows for a variety of form factors in a dense footprint to accommodate a crowded real estate environment. "We leverage our experience in designing and manufacturing reliable signal integrity connectors with compression mount technology in the near-chip connector space to provide a connector capable of supporting current and upcoming 56G and 112G designs, as well as providing additional support as customers consider moving to 224G." Ardent managing director Gordon Vinther said.

     Micro-LinkOVER is designed for chip peripherals and direct-to-substrate applications. micro-LinkOVER is the ideal solution for 100G/200G/400G systems, lnfiniband, PCle, chip-to-chip links and 5G systems. In addition, the low profile (4.2mm mating height) gives designers more flexibility, allowing them to escape from under the radiator and the bottom of the PCB, minimizing trace loss by being closer to the device.

     The micro-LinkOVER connector is designed to work with Amphenol's extensive range of external and wired backplane interfaces. As our customers move toward 112G PAM4 and beyond, the micro-LinkOVER is an ideal near-chip/on-package connector for internal wired hosts or paired with our latest generation OSFP and QSFP DD connectors to solve the most complex electrical and mechanical packaging problems. Through its innovative direct cable-to-host termination, the micro-LinkOVER is packaged in an extremely low mechanical form factor, allowing for placement under a heat sink and as close to the ASIC as possible. "The optimized signal path provides best-in-class signal integrity and excellent loss recovery performance," said Brian Kirk, Director of high-speed IO engineering at Ambrox.