An intelligent power module that improves the performance and reliability of low - and medium-power driver applications

     Infineon Technologies further expands its CIPOS™ Mini family with the introduction of the IM523 Series of High Efficiency Intelligent Power Modules (IPMs). This series of intelligent power modules uses the new 600V reverse pilot Driver 2 (RCD2) IGBT technology with open emitter. CIPOS IM523 Series Intelligent power modules integrate a variety of power and control components to improve reliability, optimize PCB size and reduce system costs. They can also be used to control three-phase motors in a wide range of low and medium power converters, such as home appliances, HVAC (heating, ventilation and air conditioning), and industrial fans and drivers up to 1.4KW.

     Combined with a full-featured Silicon on Insulator (SOI) gate driver, the RCD2 IGBT reduces power loss throughout the system. At the same time, a three-phase inverter configuration with an open emitter is integrated into a DIP 36x21 package. This packaging concept is particularly suitable for power applications requiring good heat transfer and electrical isolation. This series of intelligent power modules has lower switching loss than similar products, and can achieve excellent system energy efficiency, especially for high switching frequency applications.

     The rated current range of the series ranges from 6A to 17 A with a breakdown voltage of 600V. Built-in UL-certified NTC thermistor for temperature monitoring and integrated undervoltage lock (UVLO) and overcurrent protection (OCP) functions further enhance system reliability. The packaging and plastic sealing materials used improve its waterproof and moisture-proof performance. In addition, the smart power module simplifies the PCB layout by integrating a bootstrap circuit. The CIPOS IM523 Series of intelligent power modules are packaged in an industry standard package that allows easy and fast design conversion with existing Mini IPMs (P2P) without the need to redesign the PCB, thus reducing product time to market.