Bluetooth Low Power system level chips support the latest Bluetooth 5.4 specification

     Infineon announced that AIROC™ CYW20829 Bluetooth Low Power System-level Chip (SoC) will support the latest Bluetooth 5.4 specification. With its combination of low power and high performance, AIROC™ CYW20829 supports the full range of Bluetooth Low Power (LE) use cases, including smart homes, sensors, medical care, lighting, Bluetooth mesh networks, remote control, human-computer interaction devices (mouse, keyboard, virtual reality and game controllers), industrial automation, and automotive.

     The newly released Bluetooth Core 5.4 specification adds several important functions on the basis of the existing specification, including PAwR (periodic broadcast with response), EAD (encrypted broadcast data), LE GATT security level features, etc. PAwR can realize energy-saving bidirectional communication in large-scale one-to-many or star topology. EAD provides a standardized approach to secure broadcasting of data in AD packages.

     With the PAwR, thousands of electronic shelf tags (ESL) and sensors that support the Bluetooth 5.4 specification are able to communicate bidirectional with a single access point. Communication information can contain commands, sensor values, or other data defined by the application layer. EAD enables encrypted data on a star network to be authenticated and decrypted only by devices that have previously shared the session key. LE GATT Security Level feature Enables the device to identify the security mode and level of all its GATT functions. The combination of these features makes ultra-low power, efficient radio usage and secure star networks a reality that can be deployed in large-scale ESL and sensor applications.

     "With the Infineon AIROC CYW20829 Bluetooth Low Power system-level chip, our customers can achieve outstanding RF performance, the latest Bluetooth features, built-in security features, rich peripherals and low power in one device," said Shantanu Bhalerao, Vice President of Infineon Technologies Bluetooth Product Line. This device will enable our customers to enjoy the full benefits of the Bluetooth 5.4 specification and accelerate product time to market."

     The Infineon AIROC CYW20829 chip has an excellent RF link budget in its class, with a built-in integrated power amplifier that delivers 10 dBm transmit output power and a LE receiving sensitivity of -98 dBm at 1Mbps. LE-LR has a receiving sensitivity of -106 dBm at 125 Kbps.

     The CYW20829 is a dual-core Arm® M33 semiconductor device with one M33 core reserved for use as a Bluetooth controller and another Arm® Cortex-M33 core for customer applications. The CPU subsystem provides 256K of RAM, an XIP interface for external flash memory, and a rich portfolio of peripherals, including CAN, to support a variety of applications. Built-in security features include secure startup, secure execution environment, true random number generator (TRNG), Efuse-based hardware acceleration for specific key and password manipulation, and more.