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Bourns introduces five new automotive-grade SMD fuse models

Jul 25 2020 2020-07 Passive Components Bourns
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Bourns has further expanded the company's business with the new automotive-grade SMD fuse series product line. The five new SF-1206SA-W, SF-2410FPA-W, SF-2410FA-W, SF-0603HIA-M and SF-1206HIA-M model families are fully compliant with Burns' internal AEC-Q200 equivalent test procedures to ensure rugged performance in a variety of applications operating in specific harsh environments.

    Bourns has further expanded the company's business with the new automotive-grade SMD fuse series product line. The five new SF-1206SA-W, SF-2410FPA-W, SF-2410FA-W, SF-0603HIA-M and SF-1206HIA-M model families are fully compliant with Burns' internal AEC-Q200 equivalent test procedures to ensure rugged performance in a variety of applications operating in specific harsh environments.

 

     The SF-1206SA-W, SF-2410FA-W, and SF-2410FPA-W SinglFuse model families feature slow, fast, and fast precision fusion speeds in small-size EIA1206 and 2410 packages. Utilizing Burns' innovative PCB core design, these new series offer enhanced voltage and current handling capabilities, more precise hot spot control along fuse elements, improved arc suppression and surge current resistance, and superior structural integrity when compared to older ceramic tube designs.

 

     The new SF-0603HIA-M and SF-1206HIA-M model families feature Burns' advanced multi-layer ceramic design for enhanced voltage and current handling capabilities. These models are available in small size 1206 and 0603 packages with high surge current tolerance and delayed fusing speeds.

 

     The exchange continues to expand its stock portfolio SMD Fuses meet the need for effective overcurrent protection in a growing number of applications. As various systems and electronic applications become more integrated and sensitive, overcurrent threats have the potential to cause damage, reduce product life and affect equipment efficiency. Circuit protection is also important for emerging and next-generation applications such as the Internet of Things and smart sensor-based designs. These connected applications are particularly vulnerable to overcurrent events that can lead to reduced reliability and failure of one or more devices in the network.

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