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Bourns introduces four models in line with the AEC-Q200 standard series

Apr 19 2023 2023-04 Optoelectronics Bourns
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Bourns expands its industry-leading series of high-power thick film resistors with four new products conforming to the AEC-Q200 standard. The Bourns CRM-Q, CRS-Q, CMP-Q and CHP-Q series are gauge grade products with high power ratings and superior pulse load surge capability, manufactured using thick film components printed on ceramic substrate to enhance the reliability of four new resistance series.

     Bourns expands its industry-leading series of high-power thick film resistors with four new products conforming to the AEC-Q200 standard. The Bourns CRM-Q, CRS-Q, CMP-Q and CHP-Q series are gauge grade products with high power ratings and superior pulse load surge capability, manufactured using thick film components printed on ceramic substrate to enhance the reliability of four new resistance series.

 

     The characteristics offered by Bourns' new AEC-Q200 compliant resistors make it ideal for current limpers and buffer circuits, as well as balancing and deflating resistors in automotive, consumer electronics, industrial automation, power, LED lighting and communications base station applications.

 

     Bourns CRM-Q series High-power resistors and CRS-Q series surge resistant resistors are offered in three sizes from 1206(3116 metric) to 2512(6432 metric) with power ratings from 0.5 to 2 watts. The CMP-Q series of pulsed power resistors are available in five sizes from 0603(1608 metric) to 2512(6432 metric), rated from 0.25 to 1.5 watts. The CHP-Q series of ultra high power resistors are offered in five sizes from 0603(1608 metric) to 1206(3116 metric), rated from 0.33 to 0.75 watts.

 

     In order to support high currents, such as up to 60 kA, in next-generation applications, designers often have to parallel many components with low current processing capabilities. A single component capable of handling 20 kA can now be used to achieve the same level of protection with a smaller number of components in parallel, which not only reduces the total BOM amount, but also helps save valuable space on the PCB.

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