
Bourns announced the completion of the expansion of its SinglFuse overcurrent protection product line, adding 33 lines over the past 18 months. The increasing focus on security in many industries has led to an increasing demand for effective circuit protection. The extended SinglFuse™ product family meets safety standards to provide reliable overcurrent protection in sensitive circuits, supporting A wide range of current and voltage requirements with ratings up to 100 A and 600 V AC. These capabilities address overcurrent protection requirements in applications such as handheld consumer devices, telecommunications infrastructure, and industrial automation equipment, battery management, and energy storage systems.
The latest SinglFuse products feature a wide range of fusing speeds and features, including fast and slow fusing, express fusing, delay fusing, surge resistance, high current and high voltage. Bourns 's new SinglFuse components are available in 0402 to 3812 standard EIA package sizes and are compatible with most fuse products on the market, as well as a wide range of PCB layout designs.
The new and expanded Bourns SinglFuse product family offers customers the ideal overcurrent protection solution, with the ability to quickly develop and customize the design to produce fuses with unique performance specifications. Bourns has a wide range of fuse manufacturing technologies, including hollow ceramic tubes, multilayer stacked ceramics, PCB and ceramic substrate film printing processes.
Lee Bourns, product line manager for Multifuse&SinglFuse at Bourns, said: "We have significantly strengthened our SinglFuse product line as part of Bourns' strategy to design and supply the broadest and most cutting-edge circuit protection equipment on the market. Bourns is uniquely positioned to offer a comprehensive SMD fuse product line, unlike many fuse manufacturers that offer only one or two fuse technologies. This enables design engineers to choose from off-the-shelf standard SinglFuse SMD fuses, or to customize the product to meet their application requirements."
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