
KEMET announced a complete capacitance and voltage offering for KC-LINKTM ceramic surface-mount capacitors in the EIA 3640 package size. KC-LINK capacitors have excellent ripple current resistance and are ideal for use with fast-switching wide-band gap (WBG) semiconductors, which enable power converters to operate at higher voltages, temperatures, and frequencies, and achieve higher efficiency levels and greater power density. The device is suitable for DC bus, buffer and resonance applications.
KC-LINK capacitors have capacitance values ranging from 4.7nF to 220nF and voltage ranges from 500V to 1700V. These devices use Kimi Electronics' robust Class I C0G base metal electrode (BME) dielectric technology, giving them excellent capacitive stability over temperature and voltage ranges and high resistance to ripple current. In addition, the capacitor has an extremely low equivalent series resistance (ESR) and equivalent series inductance (ESL). KC-LINK capacitors operate in a temperature range of -55 ° C to +150 ° C and can therefore be installed near semiconductors for fast switching in high-density power applications.
"Designers are increasingly looking for capacitor solutions that can withstand high temperatures and pressures, and that provide stable capacitance and high ripple current resistance under these operating conditions." Dr. John Bultitude, Vice President and technical fellow at Kimi Electronics, said, "The KC-LINK solution meets all of these requirements with a single surface mount element. Such components allow designers to improve power efficiency and density in applications such as 5G telecom base stations and on-board electric vehicles."
KC-LINK capacitors are also ideal for resonant converters and wireless chargers used in applications such as cloud computing and electric vehicle charging. These applications typically require very low capacitance offset throughout the operating conditions. The mechanical strength of these capacitors is high, so installation can be achieved without a lead frame. As a result, the solution enables extremely low equivalent series inductors (ESL), increasing the operating frequency range and further miniaturization. The series is available in both commercial and automotive (AEC-Q200) classes and is lead-free, RoHS and REACH compliant.
To further increase power density, KEMET has also developed KONNEKTTM technology, which utilizes innovative transient liquid phase sintering (TLPS) technology to create pin-free multi-chip solutions. When KONNEKT is combined with Kimi Electronics' KC-LINK, it enables a low-power, low-inductance package that can handle extremely high ripple currents of hundreds of kHz.
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