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Ceva Wi-Fi 6 and Bluetooth IP power Hengxuan Technology's new combination products

Jan 17 2025 2025-01 Semiconductors Connect One LTD.
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Ceva, Inc., a global leader in IP licensing of semiconductor products and software that enables intelligent edge devices to connect, sense and infer data more reliably and efficiently, Bestechnic, a global leader in the design and development of wireless ultra-low power computing SoCs for advanced smart audio, smart wearables, wireless connectivity and smart home markets, continues its long-standing partnership with Ceva.

     Ceva, Inc., a global leader in IP licensing of semiconductor products and software that enables intelligent edge devices to connect, sense and infer data more reliably and efficiently, Bestechnic, a global leader in the design and development of wireless ultra-low power computing SoCs for advanced smart audio, smart wearables, wireless connectivity and smart home markets, continues its long-standing partnership with Ceva. The Ceva-Waves Wi-Fi 6 and Bluetooth dual-mode IP platforms are integrated into its new Bluetooth /Wi-Fi portfolio, which includes the BES2610 and BES2800 series. Henghyun Technology is one of the world's leading suppliers of smart audio SoCs for TWS earbuds, headphones, smart glasses, smartwatches and smart speakers, and has shipped more than 1 billion smart audio SOCs using Ceva Bluetooth dual-mode IP to date.

 

     ABI Research predicts that annual shipments of Wi-Fi 6 products will reach nearly 2.7 billion by 2027. This growth is largely attributable to Wi-Fi 6 being used in a variety of devices, including smart audio products such as TWS earbuds, smart speakers, and other wearables. Compared to previous generations of Wi-Fi standards, Wi-Fi 6 is designed to deliver high efficiency and high performance while significantly reducing power consumption, making it ideal for battery-powered iot devices such as wearables and speakers. Wi-Fi 6 complements Bluetooth audio capabilities to provide high throughput and low latency, which are critical for high-definition audio streaming, and embedded AI-related real-time data processing is increasingly in demand in this regard.

 

     Ceva-Waves Wi-Fi 6 IP and Ceva-Waves Bluetooth dual-mode IP are deployed in the recently launched combination series of ultra-low energy Bluetooth /Wi-Fi audio SOCs. These platforms integrate a dual-mode Bluetooth 5.4 subsystem for Bluetooth Classic and LE Audio, and a Wi-Fi 6 subsystem for high-throughput wireless connectivity and lossless audio. This highly integrated solution uses BES optimised ultra-low power systems, enabling Wi-Fi devices to achieve low power performance similar to Bluetooth. For example, 2.4GHz Wi-Fi RX has a current as low as 14mA, making it ideal for battery-powered wearables.

 

    Zhao Guoguang, General Manager of Hengxuan Technology, said: "Long-term cooperation with Ceva is the key to our success. We are excited to integrate their Wi-Fi 6 IP into the company's latest portfolio of products." The partnership enables us to offer our customers cutting-edge wireless connectivity solutions that go beyond the requirements of high-definition audio streaming and other ultra-low power wearable applications, such as smartwatches and smart glasses."

 

     Tal Shalev, vice president and general manager of Ceva's Wireless Internet of Things Business unit, said: "The acquisition of our Wi-Fi 6 and Bluetooth dual-mode IP by Hengxuan Technology demonstrates the superior value of our comprehensive wireless connectivity portfolio in addressing emerging trends and applications. Embedded artificial intelligence is rapidly moving into every device around us, and seamless connectivity is an important foundation for the operation of these devices. With the powerful data transmission capabilities offered by Wi-Fi 6, complemented by Bluetooth for streaming audio applications, our wireless connectivity IP offers unmatched performance and power, helping Hengxun set a new benchmark for smart audio devices."

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