Germany's Congatec, the world's leading provider of embedded and edge computing technologies, introduces a new COM Express compact computer module powered by AMD Ryzen Embedded 8000 series processors. Based on the dedicated computing core of the new Ryzen processor, the module features up to eight "Zen 4 "cores, an innovative XDNA™ NPU, and a powerful Radeon RDNA 3™ graphics processor that delivers up to 39 TOPS of computing power for AI reasoning.
This makes the new conga-TCR8 Type 6 module particularly useful in high-volume, price-sensitive applications that require a combination of advanced AI, graphics, and computing power. Oems in areas such as medical imaging, test & measurement, AI-enabled POS/POI systems, and professional gaming can take advantage of these long-available COM Express compact modules to accelerate innovation while ensuring investment security. With a wide, scalable TDP power range (15 to 54 watts), this module is also ideal for upgrading existing designs. By simply replacing modules, their products can be upgraded to the latest technology, significantly improving product life cycle, return on investment and sustainability.
Martin Danzer, Director of Product Management at Congatec, explains: "The new AMD Ryzen Embedded 8000 based modules not only extend our family of high-performance edge AI platforms for innovative applications, but also make it easy for developers to enjoy the benefits of system integration with the aReady.COM version. This new processor platform combines powerful CPU, GPU, and NPU cores and is very easy to integrate. Customers and users will benefit from configured virtualization software, pre-installed operating systems, enhanced IoT software, and flexible scaling options to gain advantages in cost, efficiency, and reliability."
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