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Dialog joins TDK to create the world's smallest point-of-load DC-DC converter solution

Dec 5 2020 2020-12 Semiconductors Dialog Semiconductor GmbH
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Dialog Semiconductor announced a partnership with TDK, a global leader in smart society electronics solutions, to combine Dialog's GreenPAK technology in TDK's latest µPOL™ power solution family to create the world's first monolithic integrated system power timing solution.

     Dialog Semiconductor announced a partnership with TDK, a global leader in smart society electronics solutions, to combine Dialog's GreenPAK technology in TDK's latest µPOL™ power solution family to create the world's first monolithic integrated system power timing solution.

 

     Traditional discrete solutions on the market today require a range of components, take up more board space, affect system reliability, and drive up manufacturing costs. Incorporating Dialog's scalable and highly flexible GreenPAK technology into TDK's small-size, high-density power module solutions reduces the number of components required, enabling more compact, reliable, and powerful power solutions for advanced industrial embedded control, IoT, and 5G applications.

 

     Dialog's GreenPAK technology shortens product lead times to just four to six weeks, supports high volume production, and accelerates development cycles for boards for complex systems. The µPOL solution utilizes advanced packaging technologies such as on-chip Substrate packaging (SESUB), enabling aggregated 3D systems to be integrated in smaller sizes and thinner packages. The collaboration enables TDK to provide solutions with higher power density and ease of use compared to existing solutions in the market, as well as lower overall system costs. TDK's FS1406 6A power module, for example, delivers 15W of power in 3.3mm x 3.3mm x 1.5mm dimensions, with a current density four times higher than the nearest competing solution.

 

     "The combination of our µPOL micro embedded DC/DC converters with Dialog's compact power sequential enables smaller size and higher power density, giving customers greater ease of use and lower total cost of ownership," said Parviz Parto, president of Faraday Semi, part of TDK Group.

 

     Davin Lee, senior vice President and general manager of the Advanced Mixed Signal Business Unit at Dialog Semiconductors, said: "By partnering with TDK, we combine the flexibility, configurability, and scalability of GreenPAK technology with the industry's most compact and power-dense TDK point-of-load solution into a single chipset, enabling a power timing system that is more cost-effective, power-efficient, fully integrated, and reliable than existing solutions in the market."

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