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Dialog launches SmartBond TINY module to help accelerate IoT development

Oct 4 2020 2020-10 Semiconductors Dialog Semiconductor GmbH
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Dialog Semiconductor, a supplier of highly integrated power management, charging, AC/DC power conversion, Bluetooth low power, low power Wi-Fi and industrial ics, announced the launch of the DA14531 SmartBond TINY module to help customers develop the next generation of connected devices.

     Dialog Semiconductor, a supplier of highly integrated power management, charging, AC/DC power conversion, Bluetooth low power, low power Wi-Fi and industrial ics, announced the launch of the DA14531 SmartBond TINY module to help customers develop the next generation of connected devices.

 

     The SmartBond TINY module is optimized to significantly reduce the cost of adding Bluetooth low power connectivity to IoT systems. Its easy-to-use design and software help developers quickly and intuitively develop high-performance connected devices targeting applications such as next-generation consumer electronics, smart healthcare, smart home, and smart appliances. The module combines two unique software features that remove the complexity of traditional Bluetooth low-power development, enabling customers to develop powerful IoT products without regard to their software coding capabilities.

 

     The first feature is the configurable Dialog Serial Port Service (DSPS) software, which simulates a universal Asynchronous transceiver (UART) serial port based on BLE, eliminating the need to write Bluetooth software for BLE data transparent applications when connecting modules to the serial port of the host MCU. The second feature is Dialog's new Codeless software, which helps customers create applications by replacing complex code with a series of simple human-readable ASCII commands, further simplifying the development process. Codeless uses the industry standard Hayes AT-type command set to configure and run the module.

 

     Sean McGrath, senior vice President, Connectivity and Audio Business Unit, Dialog Semiconductor, said: "Our SmartBond TINY DA14531 SoC, launched in 2019, sets a new industry standard for pricing Bluetooth low power SoCs - below $0.50. The DA14531 module further leverages the functional benefits of the SoC, including an integrated antenna and all the required components to reduce the overall cost of adding Bluetooth low power connectivity to IoT systems to less than $1 (high annual usage). Offering such high BLE features, performance and quality at such a competitive price is unmatched by other competitors. Not only does the module push the boundaries of cost and power consumption, it is extremely easy to use for beginners and experts alike, ensuring that all customers benefit from its high integration and configurable ease of use."

 

     The module, which can be manually welded in a stamp-shaped package, offers 9 GPIOs and measures 12.5 x 14.5mm. All external components, including passive components, external crystal oscillator (XTAL), antenna and flash memory, are integrated into the SmartBond TINY module, eliminating the need for customers to purchase separate components.


     The SmartBond TINY module is fully certified for global operation and is FCC certified in the Americas and CE certified in Europe. Customers no longer need to certify the platform themselves, further reducing development time, effort and cost. The module conforms to Bluetooth 5.1 specification, supports software wireless upgrade, and can stand the test of the future.

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