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Diodes introduces space saving Schottky rectifier

Sep 17 2022 2022-09 Passive Components Diodes Incorporated
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Diodes announced a line of high-current Schottky rectifiers in ultra-small chip level packages (CSP), SDM5U45EP3 (5A, 45V), SDM4A40EP3 (4A, 40V) and SDT4U40EP3 (4A, 40V) reach the highest current density of the same level in the industry, meeting the market demand for smaller and higher power electronic systems.

     Diodes announced the launch of a series of high current Schottky rectifiers in ultra-small chip level package (CSP), SDM5U45EP3 (5A, 45V), SDM4A40EP3 (4A, 40V) and SDT4U40EP3 (4A, 40V) to reach the highest current density in the industry, meeting the market demand for smaller and higher power electronic systems.

 

     Each device can be used for various purposes, such as current blocking or reverse polarity protection diode, electrical overvoltage protection diode, and free wheel diode. This series of rectifiers are specially designed for product applications with limited space, such as portable, mobile and wearable devices, and Internet of Things hardware.

 

     The SDT4U40EP3, the top of the three, is the industry's smallest 4A groove Schottky rectifier, which adopts the 1608 packaging specification unprecedented. Compared with other brand devices, it can save 90% of PCB area. With a current density of 800A/cm2, it is the industry leader in grooved Schottky products, thanks to the innovative cathode design and manufacturing process in the patent application. The resulting ultra-low forward voltage efficiency (typical value is 0.47V) can minimize the power loss and achieve a more efficient system design. In addition, the excellent avalanche capability ensures stability and durability under extreme operating conditions such as transient voltage.

 

     The size of the SDM5U45EP3 packaged with X3-TSN1616-2 is 2mm2, while the size of the SDM4A40EP3 and SDT4U40EP3 packaged with X3-TSN1608-2 is 1.28mm2, which helps system designers to obtain the largest available space for circuit boards in modern, highly integrated consumer products. These ultra-thin CSP packages are 0.25mm (typical) in size and have shorter heat conduction paths, which can achieve better power consumption, lower thermal BOM costs, and improve reliability.

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