Diodes introduces the industry's smallest ultra-thin bus switch with integrated diodes to save board space

     Diodes Incorporated announced that its family of four-channel and dual-channel 4:1 and 2:1 bus switches is now available in its ultra-thin QFN (UQFN) product packages. The UQFN package makes it easier for Oems to increase PCB density and reduce product size when developing PC notebooks and tablets, as well as networking and telecommunications equipment.

     Discrete logic devices, such as bus multiplexers and decoders, remain key elements of embedded design. The UQFN package size is only 3mm x 3mm x 0.65mm high, which is significantly smaller than comparable devices in standard packages. This smaller size allows the bus switch to be added to almost any design, even those with a higher component density.

     Each channel in the bus switch can multiplex/multiplex an output between two or four inputs. When the paths of all channels are selected through a common input, the channels benefit from dedicated active low-enable control, allowing each channel to operate independently. All devices offer three-state operation with a high impedance output when the enable pin is held high.

     The UQFN package used in the device includes a heat pad for more efficient heat dissipation. In addition, all devices in the four variants have very low on-resistance (only 5Ω), near-zero propagation delay, and ultra-low static current.

     The PI3B3253 and PI3B3257 (dual, 4:1) and PI3CH480 and PI5C3257 (quad, 2:1) bus switches were previously only available in QSOP and TSSOP packages, providing pin compatibility with industry standard 74 series logic devices. The ZHD suffix on the part number indicates UQFN packaging. By adding UQFN, which is one of the smallest packages, to the package options, the diode gives Oems increased choice and even greater design flexibility.