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Direct Insight introduces the i.MX8 SoM module

Oct 4 2020 2020-10 Power DLP Design Inc.
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System integrator Direct Insight has introduced the QS8M welding module, produced by its long-time partner Ka-Ro Electronics Materials based in Aachen, which integrates NXP I.M8M quad-core or dual-core Cortex-A53 64-bit processors, as well as RAM, flash memory and power management. The module features a QFN-style pin arrangement that provides excellent miniaturization, thermal efficiency and EMI performance.

     System integrator Direct Insight has introduced the QS8M welding module, produced by its long-time partner Ka-Ro Electronics Materials based in Aachen, which integrates NXP I.M8M quad-core or dual-core Cortex-A53 64-bit processors, as well as RAM, flash memory and power management. The module features a QFN-style pin arrangement that provides excellent miniaturization, thermal efficiency and EMI performance.

 

     In addition to optimizing size and cost, the module also improves assembly efficiency in a number of ways, such as contact pads around the edges to help with inspection, and easy wiring, even allowing the use of two-layer substrates. The special ground plane layout means that the module effectively "floats" into place during reflow, unlike the BGA, which sits on a convex block and may require X-ray inspection. In addition, at just 27 x 27mm, they are small enough to avoid warping, which can adversely affect larger boards.

 

     The i.MX8M Mini/Nano series processors in the QS8M module are available with dual-core (i.MX8M Nano) or quad-core (i.MX8M Mini) 1,400- / 1,600-MHz Arm The Cortex-A53 processor combination along with a separate GPU and video codec (Mini only). The module features up to 1 GB of DDR3L RAM and 4 GB of eMMC flash memory, and has a wide range of interfaces including CANbus, UART, SPI, I2C, audio, Ethernet, SD, USB host and client, and MIPI-DSI display. The i.MX8M Nano and Mini combine low-power operation with powerful features, including MIPI-DSI displays up to 1080p. Industrial temperature specifications for both modules range from -25 °C to 85°C. The QS8M series is supported by a dedicated development system with Linux BSP (Windows 10 IoT and QNX are also available).

 

     A dedicated development kit, QSBASE2, is also provided to support design activities. This is welded together with the QS8M module, but all contacts are accessible through a plug. The kit has extensions and display connectors that are compatible with Raspberry Pi, so Raspberry Pi's plugins and displays are available for development. Also included are five USB ports (one client) and gigabit Ethernet, UART and MIPI-CSI camera connectors.

 

     David Pashley, managing director of Direct Insight, said: "This is the first of a new class of system-level modules where users have turned to sold-on SoM for simplicity and cost reduction, but have found that certain designs, such as BGA-type devices, are difficult to succeed in production environments, and these new QS8M SoM offer a more user-friendly way to manufacture."

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