Explore interconnect design trends, trade-offs, and the convergence of emerging technology firmness and miniaturization

Molex, a global leader in the electronics industry and developer of innovative connectors, recently released a report. The report provides an in-depth look at how to unlock new opportunities for electronic device innovation across a wide range of industries by providing robust and miniaturized interconnect solutions. The report, "Breaking Boundaries: Combining Ruggedness and Miniaturization in Connector Design," focuses on interconnect solution design trends, tradeoffs, and enabling technologies that can remove barriers and help us shape the future of electronics.

Carrieanne Piccard, vice president and general manager of Connected Mobility Solutions at Molex, said: "As the demand for electronic devices for new automotive platforms continues to grow, so does the need for smaller, more robust connected products that can operate reliably in extremely demanding environments. As a result, making connectors more robust and miniaturized has become a core design principle that requires an integrated approach across the entire life cycle of the component to achieve optimal product reliability, performance and service life."

Connectors are a key factor in promoting the development of various fields

In this industry report, Molex defines small connectors as those with a terminal spacing of no more than 2.54 mm, while their robustness is reflected in their ability to adapt to the harshest environments and mechanical stresses. This trend of combining the miniaturization of connectors with ruggedness is driving significant innovation in the automotive industry, particularly in support of electric vehicles (EVs) and partition architectures. This trend is now permeating other industries, including consumer electronics (such as fitness trackers, smartwatches, and smart home devices), industrial automation (such as industrial robots, touch screens, and sensors), and medical devices (such as endoscopes, insulin pumps, and wearable health monitors).

Compact and rugged connectors are also favored in smart agriculture and other applications. Vertical farming systems with dense sensors and lighting fixtures require space-saving connectors that can operate continuously in humid environments. Smaller, lighter and more robust connectors in agricultural drones or "flying tractors" also need protection against extreme temperatures, excessive vibration and moisture, dust and corrosive chemicals.

Push design boundaries

Molex's latest report explores best practices for removing major design and manufacturing barriers to facilitate the design of smaller, lighter, and more reliable connectors. Aluminum alloys and dedicated high-strength steels as well as high-performance polymers offer excellent durability and lightweight construction. However, machining these materials into connectors with complex geometric shapes often requires specialized technology, including several techniques ranging from microforming and high-precision machining to laser welding or selective plating.

In addition, the use of high-density terminal spacing layouts can increase contact density and accommodate smaller device sizes, but requires high precision manufacturing and assembly. This can create crosstalk risks and heat dissipation issues. To address these challenges, engineers can employ advanced signal routing technologies, shielded isolation measures, and thermal management strategies, such as heat sinks or hot through-holes. Molex's DuraClik connector housing is made of high-temperature PBT material with robust terminal retention to withstand extreme driving conditions.

Multifunction terminals (MFT) integrate multiple functions (power, signal connections, and even mechanical properties (such as locking devices) into a single compact connector, marking a major leap forward in miniaturized connector technology. Molex's latest report explores the key environmental factors that affect component reliability and suggests strategies and solutions to ensure connectors maintain optimal performance under extreme conditions. The stress relief function and terminal design enhance the performance of the connector, allowing it to remain stable during continuous vibration, shock and frequent connection operations.

At Molex's global reliability LABS, engineers simulate real-world vibrations, temperature cycles, and exposure to harsh chemicals. The Molex Micro-Lock Plus connector uses a mandatory locking mechanism to ensure a secure connection and prevent accidental loosening of the connection under strong vibration conditions. Its metal inserts provide additional stress relief for the solder joints, thereby increasing resistance to mechanical stress and vibration.

Even small amounts of water droplets or dust can cause line corrosion and short circuits, which can lead to equipment failure, so the implementation of effective protective measures is critical. The Squba connector from Molex is equipped with IP68-rated sealing technology to ensure continuous operation for up to 30 minutes at a depth of 5 feet without being affected by water. These exquisitely designed connectors optimize power transmission paths in their smallest and most durable form.