Fairchild's new extended temperature medium voltage MOSFET is rated at 175° C for ultra-high power density applications

     Fairchild is helping manufacturers improve product reliability and performance with its extended Temperature (ET) medium voltage MOSFETs that operate at 175° C. The higher operating temperature increases power density by 85% and is three times more reliable than MOSFETs rated at 150° C, the industry standard.

     This new family of ET MOSFETs is compliant with the IPC-9592 power conversion standard, in other words, its maximum junction temperature can be up to 150° C, exceeding the 125° C that can be achieved with standard 150° C MOSFETs, making greater design margin possible. The product range includes 19 new devices available in 5 mm x 6 mm and 3 mm x 3 mm standard packages and new TO-Leadless (TO-LL) packages. These devices are available in a wide range of voltage ratings, including 30V, 40V, 60V, 80V, 100V, 120V and 150V.

     Fairchild's ET MOSFET family combines superior high temperature resistance, higher power density and increased reliability to make it ideal for a variety of applications such as DC-DC, AC-DC and motor drives, including avionics, micro solar inverters, power tools and telecommunications.

     Suman Narayan, vice president, Product Line, Fairchild iFET, said: "As the latest addition to Fairchild's entire ET MOSFET product line, this new family provides designers with greater design margin when designing products that can or must withstand high temperatures, without relying on heat sinks or other cooling methods that increase product cost and complexity." "These new devices build on Fairchild's legacy of providing designers with outstanding solutions that significantly increase their design margin over competing products."

     The ability to operate at 175° C makes these new ET MOSFETs particularly suitable for products that must operate in high-temperature environments, such as solar and Power over Ethernet (POE) applications. In addition, the reliability of the equipment is greatly improved, which is a major advantage for products used in harsh environments, such as avionics, railway and power tool applications.

     The extended temperature range and higher power density provided in an ultra-small package are the main advantages of this series, allowing manufacturers to gain more product design flexibility. It can help designers reduce product size while maintaining the same power output, or increase power output without increasing size.